1-1825109-1
- Manufacturer's Part No.:1-1825109-1
- Manufacturer:
- Categories:
- Sub-Categories:
- Series:Diplomate DL
- Description:CONN IC DIP SOCKET 24POS GOLD
- Datasheet:
- Quantity:RFQAdd to RFQ List
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- Delivery:
- Available: 5079
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $0.00000 | US $0.00 |
Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.
Product Parameter
- ManufacturerTE Connectivity
- Manufacturer's Part No.1-1825109-1
- CategoriesConnectors, Interconnects
- Sub-CategoriesSockets for ICs, Transistors
- SeriesDiplomate DL
- ELVCompliant
- ECCNEAR99
- TypeDIP, 0.6 (15.24mm) Row Spacing
- ColorBlack
- MountVertical
- Width17.6mm
- Length30.5mm
- FeatureOpen Frame
- HTS Code8536.69.40.40
- Lead FreeLead Free
- PackagingTube
- Published2010
- Lead Length3.25mm
- OrientationStraight
- Part StatusObsolete
- Pbfree Codeyes
- Row Spacing15.49 mm
- TerminationSolder
- Pitch - Post0.100 2.54mm
- REACH StatusVendor Undefined
- Body MaterialThermoplastic
- Mounting TypeThrough Hole
- Number of Rows2
- Pitch - Mating0.100 2.54mm
- Approval AgencyCSA, UL
- Contact PlatingGold, Tin
- Contact MaterialCopper
- Housing MaterialThermoplastic, Glass Filled
- Contact Resistance30mOhm
- Number of Contacts24
- Flammability RatingUL94 V-0
- Number of Positions24
- Insulation Resistance10GOhm
- Operating Temperature-55°C~125°C
- Reach Compliance Codeunknown
- Contact Finish - MatingGold
- Contact Material - PostBeryllium Copper
- Termination Post Length0.128 3.24mm
- Contact Material - MatingBeryllium Copper
- Material Flammability RatingUL94 V-0
- Contact Finish Thickness - Post30.0μin 0.76μm
- Contact Finish Thickness - Mating30.0μin 0.76μm
- Number of Positions or Pins (Grid)24 (2 x 12)
Environmental & Export Classifications
- HTSUS8536.69.4040
- ECCN CodeEAR99
- RoHS StatusNot applicable
- JESD-609 Codee3
- Moisture Sensitivity Level (MSL)1 (Unlimited)
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