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2450BP07A0100T

  • In Stock: 38666
  • Available: 97054

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.38400US $0.38
10+US $0.25600US $2.56
30+US $0.19200US $5.76
100+US $0.15360US $15.36
500+US $0.14080US $70.40
1000+US $0.12800US $128.00

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Description

The 2450BP07A0100T is likely a surface mount MLCC designed for use in high-frequency RF (Radio Frequency) circuits. MLCCs are widely used in electronic circuits for decoupling, bypassing, filtering, and coupling applications due to their high capacitance density, low equivalent series resistance (ESR), and excellent high-frequency performance.

Key Features:

  • Capacitance: The "0100" in the part number indicates a capacitance value of 100 picofarads (pF).
  • Voltage Rating: The voltage rating of the capacitor is typically specified separately in the datasheet and may vary depending on the specific model.
  • Multilayer Ceramic Construction: Constructed using multiple layers of ceramic material, providing high capacitance density in a compact form factor.
  • Surface Mount Package: Designed for surface mount assembly, enabling easy integration onto printed circuit boards (PCBs) using reflow soldering techniques.
  • High-Frequency Performance: Optimized for use in RF and microwave circuits, offering low parasitic effects and high stability over a wide frequency range.
  • Temperature Stability: Provides stable capacitance over a wide temperature range, making it suitable for use in harsh operating environments.
  • Low Equivalent Series Resistance (ESR): Offers low ESR, minimizing power losses and ensuring efficient operation in high-frequency circuits.
  • RoHS Compliance: Complies with the Restriction of Hazardous Substances (RoHS) directive, ensuring environmental friendliness and regulatory compliance.

Applications: 

  • Wireless Communication: Integrated into RF front-end modules, antennas, filters, and matching networks for wireless communication systems such as cellular base stations, Wi-Fi routers, and IoT devices.
  • RF Transceivers: Used in RF transceiver circuits for signal coupling, filtering, and impedance matching in radio transmitters and receivers.
  • RF Power Amplifiers: Employed in RF power amplifier circuits for bypassing, decoupling, and stabilizing DC bias voltages.
  • RF Filters: Integrated into RF filter networks for bandpass, low-pass, and high-pass filtering in RF signal processing and frequency-selective applications.
  • Microwave Systems: Utilized in microwave circuits for signal conditioning, frequency conversion, and modulation/demodulation in radar systems, satellite communications, and microwave links.
  • Test and Measurement: Used in RF test equipment such as spectrum analyzers, network analyzers, and signal generators for signal conditioning and impedance matching.
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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