74HC238D
- Manufacturer's Part No.:74HC238D
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- In Stock: 30000
- Available: 1386
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $0.27540 | US $0.28 |
10+ | US $0.18360 | US $1.84 |
30+ | US $0.13770 | US $4.13 |
100+ | US $0.11016 | US $11.02 |
500+ | US $0.10098 | US $50.49 |
1000+ | US $0.09180 | US $91.80 |
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The 74HC238D is a high-speed CMOS integrated circuit manufactured by Toshiba Corporation. This device is a 3-to-8 line decoder/demultiplexer with input latches. It is designed to decode three binary inputs (A, B, and C) into eight mutually exclusive outputs (Y0 to Y7), making it suitable for various digital logic applications.
Key Features:
- High-Speed Operation: The 74HC238D operates at high speed, making it suitable for applications requiring rapid data processing.
- 3-to-8 Decoder/Demultiplexer: This device decodes three binary inputs into eight output lines, enabling efficient data routing and control in digital systems.
- Input Latches: The input latches allow the state of the inputs (A, B, and C) to be captured and held stable, ensuring reliable decoding.
- Low Power Consumption: The CMOS technology used in the 74HC238D results in low power consumption, making it energy-efficient and suitable for battery-powered devices.
- Wide Operating Voltage Range: The device can operate over a wide voltage range, providing flexibility in system design.
- TTL-Compatible Inputs: The inputs are TTL-compatible, allowing easy interfacing with other TTL logic devices.
- Latch Enable Input: The device features a latch enable input (LE) that allows the latched input data to be updated asynchronously.
- Wide Temperature Range: The 74HC238D is designed to operate over a wide temperature range, making it suitable for use in various environmental conditions.
Applications:
- Address decoding in microprocessor-based systems
- Data routing and selection in digital multiplexing applications
- Control signal generation in digital circuits
- Address generation in memory systems
- Input/output expansion in embedded systems
- Programmable logic arrays (PLAs) and field-programmable gate arrays (FPGAs)
- Digital displays and LED matrices
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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