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808-AG11D-LF

  • Available: 6173

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $3.08000US $3.08
10+US $2.77200US $27.72
30+US $2.15600US $64.68
100+US $1.77100US $177.10
500+US $1.69400US $847.00
1000+US $1.54000US $1540.00

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Product Parameter

  • Manufacturer
    TE Connectivity
  • Manufacturer's Part No.
    808-AG11D-LF
  • Categories
    Connectors, Interconnects
  • Sub-Categories
    Sockets for ICs, Transistors
  • Series
    800
  • ECCN
    EAR99
  • Type
    DIP, 0.3 (7.62mm) Row Spacing
  • Feature
    Open Frame
  • HTS Code
    8536.69.40.40
  • Packaging
    Tube
  • Published
    2005
  • Body Depth
    0.18 inch
  • Part Status
    Active
  • Termination
    Solder
  • Body Breadth
    0.4 inch
  • Pitch - Post
    0.100 2.54mm
  • REACH Status
    REACH Affected
  • Contact Style
    MACHINE SCREW
  • Mounting Type
    Through Hole
  • Current Rating
    3A
  • Pitch - Mating
    0.100 2.54mm
  • Terminal Pitch
    2.54mm
  • Housing Material
    Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Factory Lead Time
    9 Weeks
  • Contact Resistance
    10mOhm
  • Number of Contacts
    8
  • PCB Contact Pattern
    RECTANGULAR
  • Mating Contact Pitch
    0.1 inch
  • Insulation Resistance
    5000000000Ohm
  • Operating Temperature
    -55°C~105°C
  • Reach Compliance Code
    not_compliant
  • Body Length or Diameter
    0.4 inch
  • Contact Finish - Mating
    Gold
  • Contact Material - Post
    Copper
  • PCB Contact Row Spacing
    0.3 mm
  • Termination Post Length
    0.125 3.18mm
  • Contact Material - Mating
    Beryllium Copper
  • Material Flammability Rating
    UL94 V-0
  • Contact Finish Thickness - Post
    25.0μin 0.63μm
  • Dielectric Withstanding Voltage
    1000VAC V
  • Contact Finish Thickness - Mating
    25.0μin 0.63μm
  • Number of Positions or Pins (Grid)
    8 (2 x 4)

Environmental & Export Classifications

  • HTSUS
    8536.69.4040
  • ECCN Code
    EAR99
  • RoHS Status
    RoHS Compliant
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)

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