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BFP460H6327XTSA1

  • In Stock: 15000
  • Available: 6

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.19569US $0.20
10+US $0.13046US $1.30
30+US $0.09784US $2.94
100+US $0.07828US $7.83
500+US $0.07175US $35.88
1000+US $0.06523US $65.23

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Description

The BFP460H6327XTSA1 is a high-frequency, low-noise NPN bipolar junction transistor (BJT) manufactured by Infineon Technologies, designed for use in high-frequency amplifier and low-noise applications. This transistor features a heterojunction bipolar transistor (HBT) technology, providing excellent high-frequency performance with low noise figure characteristics. With its compact and surface-mountable package, the BFP460H6327XTSA1 is suitable for space-constrained applications in various industries, including telecommunications, wireless infrastructure, and RF systems.

Specifications:

  • Type: NPN Bipolar Junction Transistor (BJT)
  • Frequency Range: Up to 60 GHz
  • Noise Figure: Typically 1 dB at 5 GHz
  • Maximum Collector-Base Voltage (VCBO): 4 V
  • Maximum Collector Current (IC): 30 mA
  • Package: SOT-343 (Surface-Mount)

Features:

  • High-Frequency Performance: Capable of operating at frequencies up to 60 GHz, making it suitable for high-frequency amplifier applications.
  • Low Noise Figure: Offers low noise figure characteristics, making it suitable for low-noise amplifier (LNA) designs.
  • Heterojunction Bipolar Transistor (HBT) Technology: Utilizes HBT technology for improved high-frequency performance and low noise characteristics.
  • Surface-Mount Package: Compact SOT-343 package facilitates easy integration into surface-mount assemblies, suitable for space-constrained designs.
  • Wide Operating Temperature Range: Operates reliably over a wide temperature range, making it suitable for various environmental conditions.
  • RoHS Compliant: Manufactured in compliance with RoHS directives, ensuring environmental responsibility.

Applications:

  • High-Frequency Amplifiers
  • Low-Noise Amplifiers (LNA)
  • RF Front-End Modules
  • Wireless Infrastructure
  • Telecommunications Systems
  • Radar Systems
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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