BFP460H6327XTSA1
- Manufacturer's Part No.:BFP460H6327XTSA1
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- Description:RF TRANS NPN 5.8V 22GHZ SOT343-4
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- In Stock: 15000
- Available: 6
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $0.19569 | US $0.20 |
10+ | US $0.13046 | US $1.30 |
30+ | US $0.09784 | US $2.94 |
100+ | US $0.07828 | US $7.83 |
500+ | US $0.07175 | US $35.88 |
1000+ | US $0.06523 | US $65.23 |
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The BFP460H6327XTSA1 is a high-frequency, low-noise NPN bipolar junction transistor (BJT) manufactured by Infineon Technologies, designed for use in high-frequency amplifier and low-noise applications. This transistor features a heterojunction bipolar transistor (HBT) technology, providing excellent high-frequency performance with low noise figure characteristics. With its compact and surface-mountable package, the BFP460H6327XTSA1 is suitable for space-constrained applications in various industries, including telecommunications, wireless infrastructure, and RF systems.
Specifications:
- Type: NPN Bipolar Junction Transistor (BJT)
- Frequency Range: Up to 60 GHz
- Noise Figure: Typically 1 dB at 5 GHz
- Maximum Collector-Base Voltage (VCBO): 4 V
- Maximum Collector Current (IC): 30 mA
- Package: SOT-343 (Surface-Mount)
Features:
- High-Frequency Performance: Capable of operating at frequencies up to 60 GHz, making it suitable for high-frequency amplifier applications.
- Low Noise Figure: Offers low noise figure characteristics, making it suitable for low-noise amplifier (LNA) designs.
- Heterojunction Bipolar Transistor (HBT) Technology: Utilizes HBT technology for improved high-frequency performance and low noise characteristics.
- Surface-Mount Package: Compact SOT-343 package facilitates easy integration into surface-mount assemblies, suitable for space-constrained designs.
- Wide Operating Temperature Range: Operates reliably over a wide temperature range, making it suitable for various environmental conditions.
- RoHS Compliant: Manufactured in compliance with RoHS directives, ensuring environmental responsibility.
Applications:
- High-Frequency Amplifiers
- Low-Noise Amplifiers (LNA)
- RF Front-End Modules
- Wireless Infrastructure
- Telecommunications Systems
- Radar Systems
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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