CSD19505KTTT
- Manufacturer's Part No.:CSD19505KTTT
- Manufacturer:
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- Series:NexFET™
- Description:MOSFET N-CH 80V 200A DDPAK-3
- Quantity:RFQAdd to RFQ List
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- In Stock: 3400
- Available: 26
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $5.84500 | US $5.85 |
10+ | US $5.26050 | US $52.61 |
30+ | US $4.09150 | US $122.75 |
100+ | US $3.36087 | US $336.09 |
500+ | US $3.21475 | US $1607.38 |
1000+ | US $2.92250 | US $2922.50 |
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- Description
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- Shopping Guide
CSD19505KTTT is a specific model of a semiconductor device, likely a power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) or a similar component, produced by a manufacturer based in Texas. This device is designed for high-efficiency applications, often used in power management, switching, and amplification circuits.
The CSD19505KTTT features a compact, surface-mount package that allows for easy integration into various electronic circuits. Its design emphasizes thermal performance, enabling it to handle significant power levels while maintaining a low operating temperature. The device is characterized by its low on-resistance, which minimizes power loss during operation, making it suitable for applications such as DC-DC converters, motor drivers, and power supplies.
In terms of electrical specifications, the CSD19505KTTT typically supports high voltage and current ratings, allowing it to operate effectively in demanding environments. The gate threshold voltage is optimized for compatibility with standard logic levels, ensuring that it can be driven by common microcontrollers and digital circuits.
The package is often marked with a unique identifier, including the manufacturer's logo, part number, and other relevant information, which aids in traceability and quality assurance. The device is designed to meet industry standards for reliability and performance, making it a preferred choice for engineers and designers in the electronics field.
Overall, the CSD19505KTTT from Texas represents a robust solution for modern electronic applications, combining efficiency, reliability, and ease of use in a compact form factor.
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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