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EP1C3T100I7N

  • In Stock: 10000
  • Available: 5082

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $72.88920US $72.89
10+US $54.66690US $546.67
30+US $47.37798US $1421.34
100+US $41.91129US $4191.13
500+US $39.36017US $19680.09
1000+US $36.44460US $36444.60

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  • as
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  • iso9001
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  • Description
  • Alternatives
  • Shopping Guide
Description
Introduction
The Cyclone® field programmable gate array family is based on a 1.5-V, 0.13-μm, all-layer copper SRAM process, with densities up to 20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like phase-locked loops (PLLs) for clocking and a dedicated double data rate (DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM) memory requirements, Cyclone devices are a cost-effective solution for data-path applications. Cyclone devices support various I/O standards, including LVDS at data rates up to 640 megabits per second (Mbps), and 66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI), for interfacing with and supporting ASSP and ASIC devices. Altera also offers new low-cost serial configuration devices to configure Cyclone devices.
Features
The Cyclone device family offers the following features:
• 2,910 to 20,060 LEs, see Table 1–1
• Up to 294,912 RAM bits (36,864 bytes)
• Supports configuration through low-cost serial configuration device
• Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards
• Support for 66- and 33-MHz, 64- and 32-bit PCI standard
• High-speed (640 Mbps) LVDS I/O support
• Low-speed (311 Mbps) LVDS I/O support
• 311-Mbps RSDS I/O support
• Up to two PLLs per device provide clock multiplication and phase shifting
• Up to eight global clock lines with six clock resources available per logic array block (LAB) row
• Support for external memory, including DDR SDRAM (133 MHz), FCRAM, and single data rate (SDR) SDRAM
• Support for multiple intellectual property (IP) cores, including Altera® MegaCore® functions and Altera Megafunctions Partners Program (AMPPSM) megafunctions.
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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