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EPM570F256C4N

  • In Stock: 17370
  • Available: 2469

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $35.60000US $35.60
10+US $26.70000US $267.00
30+US $23.14000US $694.20
100+US $20.47000US $2047.00
500+US $19.22400US $9612.00
1000+US $17.80000US $17800.00

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  • Description
  • Alternatives
  • Shopping Guide
Description
Introduction
The MAX®II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layer-metal-flash process, with densities from 240 to 2,210 logic elements (LEs) (128 to 2,210 equivalent macrocells) and non-volatile storage of 8 Kbits. MAX II devices offer high I/O counts, fast performance, and reliable fitting versus other CPLD architectures. Featuring MultiVolt core, a user flash memory (UFM) block, and enhanced in-system programmability (ISP), MAX II devices are designed to reduce cost and power while providing programmable solutions for applications such as bus bridging, I/O expansion, power-on reset (POR) and sequencing control, and device configuration control.  
Features
The MAX II CPLD has the following features:
•Low-cost, low-power CPLD
•Instant-on, non-v olatile architecture
•Standby current as low as 25 μA
•Provides fast propagation delay and clock- to-output times
•Provides four global clocks with two clocks available per logic array block (LAB)
•UFM block up to 8 Kbits for non-volatile storage
•MultiVolt core enabling external supply voltages to the device of either3.3 V/2.5 V or1.8 V
•MuliVolt I/O interface supporting 3.3-V 2.5-V, 1.8-V, and 1.5-V logic levels
•Bus-friendly architecture including programmable slew rate, drive strength, .bus-hold, and programmable pull-up resistors
•Schmitt triggers enabling noise tolerant inputs (programmable per pin)
•I/Os are fully compliant with the Peripheral Component Interconnect SpecialInterest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-Voperation at 66 MHz
• Supports hot-socketing
•Builtin Joint Test Action Group JTAG) boundary-scan test (BST) circuitrycompliant with IEEE Std. 1149.1-1990
•ISP circuitry compliant with IEEE Std. 1532
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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