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EPM570GM100I5N

  • Available: 8

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $46.74018US $46.74
10+US $35.05513US $350.55
30+US $30.38112US $911.43
100+US $26.87560US $2687.56
500+US $25.23970US $12619.85
1000+US $23.37009US $23370.09

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  • Description
  • Alternatives
  • Shopping Guide
Description
Description
The MAX® II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layer-metal-flash process, with densities from 240 to 2,210 logic elements (LEs) (128 to 2,210 equivalent macrocells) and non-volatile storage of 8 Kbits. MAX II devices offer high I/O counts, fast performance, and reliable fitting versus other CPLD architectures. Featuring MultiVolt core, a user flash memory (UFM) block, and enhanced in-system programmability (ISP), MAX II devices are designed to reduce cost and power while providing programmable solutions for applications such as busbridging, I/O expansion, power-on reset (POR) and sequencing control, and device configuration control.
Features
• Low-cost, low-power CPLD
• Instant-on, non-volatile architecture
• Standby current as low as 25 µA
• Provides fast propagation delay and clock-to-output times
• Provides four global clocks with two clocks available per logic array block (LAB)
• UFM block up to 8 Kbits for non-volatile storage
• MultiVolt core enabling external supply voltages to the device of either 3.3 V/2.5 V or 1.8 V
• MultiVolt I/O interface supporting 3.3-V, 2.5-V, 1.8-V, and 1.5-V logic levels
• Bus-friendly architecture including programmable slew rate, drive strength, bus-hold, and programmable pull-up resistors
• Schmitt triggers enabling noise tolerant inputs (programmable per pin)
• I/Os are fully compliant with the Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-V operation at 66 MHz
• Supports hot-socketing
• Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990
• ISP circuitry compliant with IEEE Std. 1532
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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