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EVAL-SDP-CH1Z

  • Available: 5

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $1038.80000US $1038.80
10+US $927.50000US $9275.00
30+US $853.30000US $25599.00
100+US $786.52000US $78652.00
500+US $779.10000US $389550.00
1000+US $742.00000US $742000.00

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Description

The EVAL-SDP-H1 is a high-speed controller board for the System Demonstration Platform (SDP). It is used to evaluate a variety of Analog Devices components, including high-speed digital-to-analog converters (DACs), analog-to-digital converters (ADCs), and transceivers.

The EVAL-SDP-H1 features a Xilinx Spartan-6 FPGA and an Analog Devices ADSP-BF527 Blackfin processor. The FPGA provides the high-speed processing capabilities needed to generate and capture data for the evaluation of high-speed DACs and ADCs. The Blackfin processor provides the general-purpose processing capabilities needed for the evaluation of transceivers and other components.

 

The EVAL-SDP-H1 also includes a variety of peripherals, including high-speed serial transceivers, LVDS and LVCMOS interfaces, and general-purpose I/O pins. These peripherals can be used to connect the EVAL-SDP-H1 to a variety of evaluation boards and daughterboards.

The EVAL-SDP-H1 is supported by a comprehensive software development kit (SDK) that includes software libraries for the FPGA and the Blackfin processor. The SDK also includes a graphical user interface (GUI) that can be used to control the EVAL-SDP-H1 and configure the evaluation boards and daughterboards.

Here are some of the key features of the EVAL-SDP-H1:

  • Xilinx Spartan-6 FPGA
  • Analog Devices ADSP-BF527 Blackfin processor
  • High-speed serial transceivers
  • LVDS and LVCMOS interfaces
  • General-purpose I/O pins
  • Comprehensive software development kit (SDK)
  • Graphical user interface (GUI)

Here are some of the applications of the EVAL-SDP-H1:

  • Evaluation of high-speed DACs and ADCs
  • Evaluation of transceivers and other components
  • Development of high-speed data acquisition systems
  • Development of high-speed communication systems
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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