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FDG6332C

  • In Stock: 166000
  • Available: 78427

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.38280US $0.38
10+US $0.25520US $2.55
30+US $0.19140US $5.74
100+US $0.15312US $15.31
500+US $0.14036US $70.18
1000+US $0.12760US $127.60

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Description

The FDG6332C is a dual N-channel MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) manufactured by ON Semiconductor. It is designed for low-voltage applications and is particularly suitable for use in power management, switching, and amplification circuits.

Key Features:

  1. Configuration: The FDG6332C features two N-channel MOSFETs integrated into a single package, allowing for compact designs and efficient use of board space.

  2. Package Type: It is typically housed in a small, surface-mount package, such as the SOT-23, which facilitates easy integration into modern electronic circuits and helps reduce the overall footprint of the device.

  3. Voltage Ratings: The device has a maximum drain-source voltage (V_DS) rating of around 30V, making it suitable for a variety of low to moderate voltage applications.

  4. Current Ratings: The FDG6332C can handle continuous drain currents (I_D) of up to 3.5A, depending on the thermal conditions and the specific application, which allows it to drive moderate loads effectively.

  5. R_DS(on): One of the critical specifications of the FDG6332C is its low on-resistance (R_DS(on)), typically around 0.045 ohms at a gate-source voltage (V_GS) of 10V. This low on-resistance contributes to reduced power losses and improved efficiency in switching applications.

  6. Gate Threshold Voltage (V_GS(th)): The gate threshold voltage is typically in the range of 1V to 2.5V, which allows for easy interfacing with low-voltage control signals.

  7. Switching Speed: The FDG6332C is designed for fast switching applications, making it suitable for high-frequency operation in power converters and other switching circuits.

  8. Thermal Performance: The device is designed to handle thermal dissipation effectively, with a maximum junction temperature (T_J) rating of 150°C, allowing it to operate reliably in various environmental conditions.

  9. Applications: Common applications for the FDG6332C include load switching, power management in portable devices, DC-DC converters, and motor control circuits.

Electrical Characteristics:

  • Gate-Source Voltage (V_GS): Maximum rating typically around ±20V.
  • Drain-Source Breakdown Voltage (V(BR)DSS): Minimum rating of 30V.
  • Input Capacitance (C_iss): Typically in the range of a few hundred picofarads, which contributes to its fast switching capabilities.

Conclusion:

The FDG6332C from ON Semiconductor is a versatile and efficient dual N-channel MOSFET that is well-suited for a variety of low-voltage applications. Its compact size, low on-resistance, and fast switching characteristics make it an excellent choice for designers looking to optimize performance in power management and switching circuits.

Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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