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FH23-25S-0.3SHW(05)

  • In Stock: 10000
  • Available: 86698

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.77550US $0.78
10+US $0.51700US $5.17
30+US $0.38775US $11.63
100+US $0.31020US $31.02
500+US $0.28435US $142.17
1000+US $0.25850US $258.50

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  • Description
  • Alternatives
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Description

The FH23-25S-0.3SHW(05) is a board-to-wire connector manufactured by Hirose Electric Co., Ltd. This connector series is designed for high-density, board-to-wire applications where space-saving and reliable electrical connections are crucial. The FH23 series features a compact design with a low profile, making it suitable for use in small electronic devices and systems. The FH23-25S-0.3SHW(05) connector consists of a receptacle (board-side) and a crimp-style header (wire-side), providing a secure and durable connection between PCBs and wires. With its positive locking mechanism and high mating cycles, this connector ensures stable and vibration-resistant connections in demanding environments.

Specifications:

  • Number of Contacts: 25
  • Contact Type: Crimp
  • Pitch: 0.3 mm
  • Current Rating: 0.3A (per contact)
  • Voltage Rating: 50V AC/DC
  • Operating Temperature Range: -40°C to +85°C
  • Mating Cycles: 30 (minimum)
  • Mounting Style: Surface Mount
  • Housing Material: Heat-resistant resin
  • Locking Type: Positive lock

Features:

  • Compact Design: Low-profile connector suitable for high-density PCB layouts, saving valuable board space.
  • Secure Connection: Crimp-style contacts provide a reliable and secure connection between wires and PCBs.
  • Positive Locking: Incorporates a positive locking mechanism to prevent accidental disconnection and ensure stable connections.
  • High Mating Cycles: Designed for a minimum of 30 mating cycles, ensuring durability and longevity in applications requiring frequent connections.
  • Wide Operating Temperature Range: Operates reliably over a wide temperature range, making it suitable for various environmental conditions.
  • RoHS Compliant: Manufactured in compliance with RoHS directives, ensuring environmental responsibility.

Applications:

  • Consumer Electronics
  • Mobile Devices
  • Wearable Technology
  • Portable Medical Devices
  • Industrial Automation
  • Automotive Electronics
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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    Shipping starts at $40 but varies for destinations like South Africa, Brazil, India, and more. The actual shipping charges depend on time zone, country, and package weight/volume.

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