H11L1M
- Manufacturer's Part No.:H11L1M
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- In Stock: 70000
- Available: 3628
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $0.73260 | US $0.73 |
10+ | US $0.48840 | US $4.88 |
30+ | US $0.36630 | US $10.99 |
100+ | US $0.29304 | US $29.30 |
500+ | US $0.26862 | US $134.31 |
1000+ | US $0.24420 | US $244.20 |
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The H11L1M is a high-speed optocoupler with a logic output. It consists of an infrared emitting diode (LED) on the input side and a photodetector on the output side. The photodetector typically includes a photodiode and a high-gain transistor, providing electrical isolation between the input and output while allowing signal transmission.
Key Features:
- High-Speed Operation: Capable of high-speed signal transmission, making it suitable for digital applications.
- Logic Output: The output is compatible with TTL (Transistor-Transistor Logic) and can directly interface with various digital circuits.
- Isolation Voltage: Provides high isolation voltage (usually around 5000 Vrms) between the input and output, ensuring robust electrical isolation.
- Low Input Current: Requires low LED drive current, enhancing efficiency.
- Wide Operating Temperature Range: Suitable for use in a variety of environmental conditions.
- Compact Package: Typically available in an 8-pin DIP (Dual In-line Package) or surface-mount package, making it easy to integrate into different PCB designs.
Applications:
- Microprocessor Systems: Used to interface microcontrollers or microprocessors with other components while maintaining electrical isolation.
- Switching Power Supplies: Provides isolation and signal transmission in switching power supplies.
- Data Communication: Suitable for high-speed data communication applications that require electrical isolation.
- Industrial Automation: Used in industrial control systems to isolate control signals from high-voltage circuits.
- Telecommunications: Employed in telecommunications equipment for isolating and transmitting signals.
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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