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MEG-03

  • Available: 1435

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Product Parameter

  • Manufacturer
    OSEPP
  • Manufacturer's Part No.
    MEG-03
  • Categories
    Development Boards, Kits, Programmers
  • Sub-Categories
    Evaluation Boards - Embedded - MCU, DSP
  • Series
    AVR® ATmega
  • Part Status
    Active
  • Board Type
    Evaluation Platform
  • Type
    MCU 8-Bit
  • Core Processor
    AVR
  • Operating System
  • Platform
    OSEPP Mega 2560 R3 Plus
  • For Use With/Related Products
  • Mounting Type
    Fixed
  • Contents
    Board(s)
  • Base Part Number
  • Utilized IC / Part
    ATmega2560
  • Evaluation Kit
  • Package / Case
  • Packaging
  • Factory Lead Time
  • Published
  • Number of Bits
  • Core Architecture
  • Lead Free
  • Mount
  • Operating Supply Voltage
  • Interface
  • Data Bus Width
  • Memory Type
  • Number of I/O
  • Speed
  • RAM Size
  • Voltage - Supply (Vcc/Vdd)
  • Program Memory Type
  • Core Size
  • Program Memory Size
  • EEPROM Size
  • Ethernet
  • UART/USART
  • SPI
  • A/D
  • Can
  • USB Device
  • PWM
  • D/A
  • USB Host/OTG
  • LCD
  • Radiation Hardening
  • Number of Pins
  • Weight
    90.718474g
  • Height
    127mm
  • Length
    127mm
  • Width
    203.2mm
  • Feature
  • Current Rating
  • Max Operating Temperature
  • Min Operating Temperature
  • Memory Size
  • Connector Type
  • Resistance
  • Frequency
  • Max Frequency
  • Display Type
  • Number of UART Channels
  • Features
  • Max Supply Voltage
  • Min Supply Voltage
  • Number of Timers/Counters
  • Number of ADC Channels
  • Max Junction Temperature (Tj)
  • Number of I2C Channels
  • Ambient Temperature Range High
  • Number of USB Channels
  • Lifecycle Status
  • Mfr
  • Note
  • Interconnect System
  • Suggested Programming Environment
  • Resolution
  • Pbfree Code
  • Frequency (Max)
  • Halogen Free
  • Number of PWM Channels
  • Number of SPI Channels
  • I2C/SMBUS
  • Touchscreen
  • Dot Pixels
  • Diagonal Screen Size
  • Min Input Voltage
  • Max Input Voltage
  • Number of Cores
  • Connectivity
  • Peripherals
  • Data Converters
  • Oscillator Type
  • Operating Temperature
  • Supplier Device Package
  • Data Converter
  • Watchdog Timer
  • Number of A/D Converters
  • Mount
  • Mounting Type
  • Package / Case
  • Number of Pins
  • Operating Temperature
  • Packaging
  • Series
  • Pbfree Code
  • Part Status
  • Moisture Sensitivity Level (MSL)
  • Number of Terminations
  • HTS Code
  • Subcategory
  • Technology
  • Terminal Position
  • Terminal Form
  • Peak Reflow Temperature (Cel)
  • Supply Voltage
  • Terminal Pitch
  • Reach Compliance Code
  • Frequency
  • Reflow Temperature-Max (s)
  • Base Part Number
  • Pin Count
  • Qualification Status
  • Operating Supply Voltage
  • Power Supplies
  • Interface
  • Memory Size
  • Number of I/O
  • RAM Size
  • Memory Type
  • Voltage - Supply (Vcc/Vdd)
  • uPs/uCs/Peripheral ICs Type
  • Peripherals
  • Program Memory Type
  • Core Size
  • Program Memory Size
  • Connectivity
  • Supply Current-Max
  • Bit Size
  • Data Converter
  • Has ADC
  • DMA Channels
  • Data Bus Width
  • PWM Channels
  • DAC Channels
  • ROM (words)
  • EEPROM Size
  • Number of Programmable I/O
  • Height Seated (Max)
  • Length
  • RoHS Status
  • Lead Free
  • Surface Mount
  • Number of Terminations
  • Subcategory
  • Technology
  • Terminal Position
  • Supply Voltage
  • Pin Count
  • Supply Voltage-Max (Vsup)
  • uPs/uCs/Peripheral ICs Type
  • Bit Size
  • Has ADC
  • DMA Channels
  • PWM Channels
  • DAC Channels
  • Terminal Finish
  • Terminal Form
  • Peak Reflow Temperature (Cel)
  • Supply Voltage-Min (Vsup)
  • ROM (words)
  • Boundary Scan
  • Low Power Mode
  • Number of Programmable I/O
  • Format
  • Integrated Cache
  • RAM (bytes)
  • Thickness
  • Terminal Pitch
  • Supply Current-Max
  • Address Bus Width
  • CPU Family
  • External Data Bus Width
  • Height Seated (Max)
  • Reflow Temperature-Max (s)
  • Density
  • Max Power Dissipation
  • RAM (words)
  • Number of Serial I/Os
  • Number of DMA Channels
  • Contact Plating
  • HTS Code
  • Access Time
  • Qualification Status
  • Power Supplies
  • Bus Compatibility
  • Number of External Interrupts
  • Number of Timers
  • Additional Feature
  • Barrel Shifter
  • Internal Bus Architecture
  • Number of GPIO
  • Termination
  • On Chip Program ROM Width
  • Clock Frequency
  • ROM Programmability
  • Screening Level
  • Reach Compliance Code
  • On Chip Data RAM Width
  • Number of Ethernet Channels
  • Operating Temperature (Max)
  • Operating Temperature (Min)
  • Temperature Grade
  • Number of Outputs
  • Number of Inputs
  • Voltage
  • Nominal Supply Current
  • Lead Pitch
  • Power Dissipation-Max
  • Manufacturer Package Identifier
  • Data Rate
  • Min Supply Voltage (DC)
  • Sampling Rate
  • Operating Supply Current
  • Number of DAC Channels
  • Clock Speed
  • Flash Memory
  • Number of Channels
  • Row Spacing
  • T
  • USB
  • Device Core
  • Voltage - Rated
  • Time-Min
  • Applications
  • Voltage - Supply
  • Memory IC Type
  • Peak Reflow Temperature-Max (s)
  • Supply Type
  • k Reflow Temperature-Max (s)
  • Max Supply Current
  • Number of Drivers
  • Tim
  • ak Reflow Temperature-Max (s)
  • eak Reflow Temperature-Max (s)
  • Output Current
  • Number of Logic Elements/Cells
  • Number of Logic Blocks (LABs)
  • Adc Channels
  • Adc Resolution
  • Time
  • Surface Mount
  • JESD-609 Code
  • Terminal Finish
  • Oscillator Type
  • Number of Bits
  • Core Processor
  • Watchdog Timer
  • Number of Timers/Counters
  • Core Architecture
  • Number of A/D Converters
  • Number of UART Channels
  • Radiation Hardening
  • Factory Lead Time
  • Lifecycle Status
  • Supply Voltage-Max (Vsup)
  • Boundary Scan
  • Low Power Mode
  • Format
  • Integrated Cache
  • RAM (words)
  • RAM (bytes)
  • Number of ADC Channels
  • Number of Serial I/Os
  • Height
  • Width
  • Thickness
  • Address Bus Width
  • JESD-30 Code
  • Supply Voltage-Min (Vsup)
  • Density
  • Number of External Interrupts
  • Number of PWM Channels
  • Number of I2C Channels
  • Time@Peak Reflow Temperature-Max (s)
  • Weight
  • Number of Timers
  • REACH SVHC
  • ECCN Code
  • Time@Peak Reflow Temperature-Max (s)
  • Speed
  • Clock Frequency
  • On Chip Program ROM Width
  • Screening Level
  • Max Power Dissipation
  • CPU Family
  • Contact Plating
  • Access Time
  • Number of GPIO
  • Number of SPI Channels
  • Additional Feature
  • Barrel Shifter
  • Internal Bus Architecture
  • Number of Ethernet Channels
  • ROM Programmability
  • Bus Compatibility
  • External Data Bus Width
  • Supplier Device Package
  • Termination
  • Max Junction Temperature (Tj)
  • Ambient Temperature Range High
  • Number of USB Channels
  • Max Operating Temperature
  • Min Operating Temperature
  • Temperature Grade
  • Max Supply Voltage
  • Min Supply Voltage
  • Max Frequency
  • On Chip Data RAM Width
  • Number of Terminals
  • Seated Height-Max
  • UV Erasable
  • ROM Size (bits)
  • Special Feature
  • Capacitance - Input
  • Max Supply Voltage (DC)
  • Standby Current-Max
  • Sensing Method
  • Number of Functions
  • Number of Ports
  • Organization
  • Output Characteristics
  • Memory Width
  • Parallel/Serial
  • I/O Type
  • Sync/Async
  • Word Size
  • Standby Voltage-Min
  • Ti
  • Analog IC - Other Type
  • Adjustable Threshold
  • Supplied Contents
  • Data Interface
  • Sampling Rate (Per Second)
  • Input Range
  • Power (Typ) @ Conditions
  • Function
  • Specifications
  • Consumer IC Type
  • Number of Bands
  • Channel Separation
  • Common Mode Rejection Ratio
  • Number of Converters
  • Logic Function
  • Min Dual Supply Voltage
  • Number of Receivers
  • Polarity
  • Quiescent Current
  • Number of Input Lines
  • Harmonic Distortion
  • Max Output Current
  • Power Dissipation
  • Propagation Delay
  • Turn On Delay Time
  • Rise Time
  • Fall Time (Typ)
  • Turn On Time
  • Turn Off Time
  • Built-in Protections
  • Output Current Flow Direction
  • Output Power
  • Load Impedance
  • Gain
  • Signal to Noise Ratio (SNR)
  • Power Supply Rejection Ratio (PSRR)
  • Dual Supply Voltage
  • Telecom IC Type
  • Output Voltage
  • Differential Output
  • Input Characteristics
  • Driver Number of Bits
  • Supply Voltage1-Nom
  • Nominal Input Voltage
  • Input Offset Voltage (Vos)
  • Bandwidth
  • Power Consumption
  • Gain Bandwidth Product
  • Output
  • Input Voltage (Min)
  • Input Voltage (Max)
  • Off-state Isolation-Nom
  • Switching
  • Switch-on Time-Max
  • Switch-off Time-Max
  • Number of Analog Inputs
  • Impedance
  • Conversion Rate
  • Output Type
  • Receiver Number of Bits
  • Output Polarity
  • Number of Transmitters
  • High Level Input Current-Max
  • Normal Position
  • Max Dual Supply Voltage
  • Converter Type
  • Input Format
  • Analog Output Voltage-Max
  • Number of Elements
  • Slew Rate
  • Voltage Gain
  • Negative Supply Voltage-Nom
  • Output Low Current-Max
  • Power Rating
  • Settling Time
  • Power - Output
  • Number of D/A Converters
  • Analog Output Voltage-Min
  • Interface IC Type
  • Interface Standard
  • Out Swing-Min
  • Max Output Power
  • Applications
  • Voltage - Supply
  • Function
  • Number of Channels
  • Number of Amplifiers
  • Resistance
  • Output
  • Analog IC - Other Type
  • Max Supply Current
  • Turn On Delay Time
  • Input Voltage (Min)
  • Input Voltage (Max)
  • Bandwidth
  • Turn-Off Delay Time
  • Off-state Isolation-Nom
  • Switching
  • Switch-on Time-Max
  • Switch-off Time-Max
  • Output Power
  • Specifications
  • Consumer IC Type
  • Nominal Supply Current
  • Logic Function
  • Max Dual Supply Voltage
  • Min Dual Supply Voltage
  • Dual Supply Voltage
  • Operating Supply Current
  • Resolution
  • Signal to Noise Ratio (SNR)
  • Differential Output
  • Input Characteristics
  • Interface IC Type
  • Receiver Number of Bits
  • Interface Standard
  • Sampling Rate
  • Conversion Rate
  • Number of Functions
  • Power - Output
  • Number of Output Lines
  • Voltage - Rated DC
  • Operating Mode
  • Filter
  • Companding Law
  • Positive Input Voltage-Max
  • Supply Current-Max (Isup)
  • Diagonal Size
  • Topology
  • Capacitance
  • Material
  • Gender
  • Plating
  • Screw Thread
  • Threaded/Unthreaded
  • Length - Overall
  • Diameter - Inside
  • Between Board Height
  • Housing Material
  • Material - Frame
  • Material - Blade
  • Size / Dimension
  • Power (Watts)
  • Depth
  • Approval Agency
  • Lifetime @ Temp
  • RPM
  • Bearing Type
  • Fan Type
  • Air Flow
  • Noise
  • Thermal Support Device Type
  • Rated Power
  • Pitch
  • Number of Contacts
  • Hole Diameter
  • Proto Board Type
  • Circuit Pattern
  • Edge Contacts
  • Board Thickness
  • Flammability Rating
  • Color
  • Lead Style
  • Lead/Base Style
  • Lens Style
  • Lens Size
  • MSCP (Mean Spherical Candle Power)
  • Termination Style
  • Motor Type
  • Diameter - Shaft
  • Length - Shaft and Bearing
  • Shape
  • Thread Size
  • Wire/Cable Diameter
  • Diameter
  • Diameter - Outside
  • Contact Material
  • Number of Rows
  • Contact Finish - Mating
  • MIL Conformance
  • DIN Conformance
  • IEC Conformance
  • Filter Feature
  • Mixed Contacts
  • Option
  • Total Number of Contacts
  • Contact Gender
  • UL Flammability Code
  • Body/Shell Style
  • Termination Type
  • Contact Finish Termination
  • Shelf Life
  • Storage/Refrigeration Temperature
  • Shelf Life Start
  • Head Diameter
  • Grip Range
  • Rivet Diameter
  • Panel Thickness
  • Head Height
  • Size
  • Tool Type
  • Tip - Type
  • Length - Blade
  • Frequency Range
  • Amplitude (Level) Range
  • Finish
  • Orientation
  • Actuator Type
  • Built in Switch
  • Encoder Type
  • Detent
  • Pulses per Revolution
  • Embedded
  • Outside Diameter
  • Drive Type
  • Screw Head Type
  • Length - Below Head
  • Number of Conductors
  • Wire Gauge
  • Contact End
  • Accessory Type

Environmental & Export Classifications

  • Moisture Sensitivity Level (MSL)
  • RoHS Status
    Non-RoHS Compliant
  • REACH SVHC
  • JESD-30 Code
  • JESD-609 Code
  • ECCN Code
  • HTSUS

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