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MT9VDDT6472HG-335F2

  • Available: 5085

Reference Price(In US Dollars)

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Product Parameter

  • Manufacturer
    Micron Technology
  • Manufacturer's Part No.
    MT9VDDT6472HG-335F2
  • Categories
    Memory Cards, Modules
  • Sub-Categories
    Memory - Modules
  • Series
    -
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Mount
    Socket
  • Packaging
    Bulk
  • Speed
    333MT/s
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    235
  • Number of Functions
    1
  • Organization
    64MX72
  • Memory Width
    72
  • Memory Density
    4831838208 bit
  • Lead Free
    Contains Lead
  • Radiation Hardening
    No
  • Height
    31.8mm
  • HTS Code
    2.7V
  • Number of Terminations
    200
  • Supply Voltage
    2.5V
  • Clock Frequency
    166MHz
  • Terminal Pitch
    0.6mm
  • Additional Feature
    AUTO/SELF REFRESH
  • Terminal Finish
    TIN LEAD
  • Pin Count
    200
  • Temperature Grade
    COMMERCIAL
  • Access Time (Max)
    0.7 ns
  • Subcategory
    Other Memory ICs
  • Number of Ports
    1
  • Data Buffer (byte)
    512MB
  • Supply Current-Max
    3.645mA
  • Output Characteristics
    3-STATE
  • Standby Current-Max
    0.045A
  • I/O Type
    COMMON
  • Voltage - Rated DC
    333MHz
  • Data Bus Width
    72b
  • Number of Elements
    9
  • Data Retention Time-Min
    Obsolete
  • Memory Type
    DDR SDRAM
  • Operating Vibration (g)
    Non-RoHS Compliant
  • Non Operating Shock Rate (g)
    1 (Unlimited)
  • Number of Heads
    2002
  • Package / Case
    200-SODIMM
  • Number of Pins
    200
  • uPs/uCs/Peripheral ICs Type
    2.3V
  • Frequency
    2.5V
  • Non-Operating Vibration (g)
    70°C
  • Rotational Speed (r/min)
    0°C

Environmental & Export Classifications

  • JESD-609 Code
    e0

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