NT5CC256M16ER-EKI
- Manufacturer's Part No.:NT5CC256M16ER-EKI
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- In Stock: 5068
- Available: 10000
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $5.30272 | US $5.30 |
10+ | US $4.77245 | US $47.72 |
30+ | US $3.71190 | US $111.36 |
100+ | US $3.04906 | US $304.91 |
500+ | US $2.91650 | US $1458.25 |
1000+ | US $2.65136 | US $2651.36 |
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The NT5CC256M16ER-EKI is a DRAM memory component that typically comes in a Ball Grid Array (BGA) package. This part is a high-performance dynamic random-access memory (DRAM) module designed for fast data access and efficient data storage.
Key Features:
- Memory Type: DRAM, typically a synchronous DRAM (SDRAM) or a Double Data Rate (DDR) SDRAM variant.
- Capacity: The part offers a specific memory capacity (e.g., 4 Gb) based on its part number, which may vary depending on the manufacturer's product line.
- Data Bus Width: Likely supports a data bus width of 16 bits, as indicated by the part number.
- Operating Frequency: Operates at a specific clock frequency (e.g., 1333 MHz, 1600 MHz), which should be referenced from the datasheet.
- Low Voltage Operation: Operates at a specified low voltage (e.g., 1.5V or 1.35V for low-power consumption).
- CAS Latency: Offers a certain CAS latency for efficient data read/write operations (refer to datasheet for specific latency values).
- Temperature Range: Functions over a range of operating temperatures, typically from -40°C to 85°C.
- BGA Package: Comes in a compact Ball Grid Array (BGA) package, suitable for high-density mounting on PCBs.
Applications:
- Computing Devices: Suitable for use in computers, servers, and other computing devices for system memory.
- Embedded Systems: Can be applied in embedded systems for data storage and processing.
- Networking Equipment: Useful in networking devices such as routers and switches for fast data access.
- Consumer Electronics: Can be used in consumer electronics for multimedia, gaming, and other applications.
- Mobile Devices: Ideal for smartphones, tablets, and other mobile devices where high-speed memory is required.
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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