Why We Use Chip X-ray Photography for Chip Detection

Chip X-ray photography, also known as chip X-ray radiography, is a useful method for inspecting electronic components such as printed circuit boards (PCBs) and integrated circuits (ICs). This is because X-rays have a high penetrating power that enables them to pass through solid objects, including electronic components.

 

Chip X-ray detection technology has the advantages of fast speed, non-destructive and low cost in chip authenticity detection.

Chip X-ray photography is an important tool in the inspection and quality control of electronic components, enabling manufacturers to detect defects and ensure the reliability and safety of their products.

 

IC Package Inspection: Chip X-ray photography is commonly used to inspect the internal structure of IC packages, which can consist of several layers of materials such as silicon, metal and plastic. By imaging through these layers, chip X-rays can reveal any voids or defects present in the package.

 

Solder Joint Analysis: Solder joints, which connect electronic components to a PCB, are critical to the reliability of an electronic device. Chip X-ray photography can be used to inspect solder joints for issues such as incomplete wetting, insufficient solder volume, or voids.

 

Counterfeit Detection: Chip X-ray photography can also be used as a tool to detect counterfeit electronic components. By imaging through the packaging material, chip X-rays can determine whether the internal structure of the component matches the expected design.

 

Failure Analysis: In the event of a failure in an electronic device, chip X-ray photography can be used as a non-destructive tool to analyze the root cause. For example, if a device failed due to a short circuit, a chip X-ray image can show whether two conductive components were too close together.

 

Chip X-ray photography can reveal any defects in the components, such as cracks or voids, which may not be visible to the naked eye. It can also detect other issues such as solder joint quality, wire bonds, or delamination of layers in multilayer PCBs. By identifying these defects early on, manufacturers can prevent failures and ensure the reliability and safety of the electronic device.