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74FCT162244CTPACT

  • Available: 2000

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $1.53600US $1.54
10+US $1.02400US $10.24
30+US $0.76800US $23.04
100+US $0.61440US $61.44
500+US $0.56320US $281.60
1000+US $0.51200US $512.00

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  • Description
  • Alternatives
  • Shopping Guide
Description
:
The 16-Bit Buffer/Line Driver is for bus interface or signal buffering applications requiring high speed and low power dissipation.
These devices have a flow through pin organization, and shrink packaging to simplify board layout. All inputs are designed with hysteresis for improved noise margin.
The three-state controls allow independent 4-bit, 8-bit or combined 16-bit operation.
These parts are plug in replacements for 54/74ABT16244 where higher speed, lower noise or lower power dissipation levels are desired.
FEATURES:
• Common features:
– 0.5 MICRON CMOS Technology
– High-speed, low-power CMOS replacement for ABT functions
– Typical tSK(o) (Output Skew) < 250ps
– Low input and output leakage ≤ 1µA (max.)
– ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0)
– Packages include 25 mil pitch SSOP, 19.6 mil pitch TSSOP, 15.7 mil pitch TVSOP and 25 mil pitch Cerpack
– Extended commercial range of -40°C to +85°C

Features for FCT16244T/AT/CT/ET:
– High drive outputs (-32mA IOH, 64mA IOL)
– Power off disable outputs permit “live insertion”
– Typical VOLP (Output Ground Bounce) < 1.0V at VCC = 5V, TA = 25°C

Features for FCT162244T/AT/CT/ET:
– Balanced Output Drivers: ±24mA (commercial), ±16mA (military)
– Reduced system switching noise
– Typical VOLP (Output Ground Bounce) < 0.6V at VCC = 5V,TA = 25°C

Features for FCT166244T/AT/CT:
– Light Drive Balanced Output: ±8mA (commercial), ±6mA (military)
– Minimal system switching noise
– Typical VOLP (Output Ground Bounce) < 0.25V at VCC = 5V,TA = 25°C

Features for FCT162H244T/AT/CT/ET:
– Bus-Hold retains last active bus state during 3-state
– Eliminates the need for external pull up resistors
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

SHIPPING GUIDE

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