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74HCT541D

  • Available: 32000

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.54432US $0.54
10+US $0.36288US $3.63
30+US $0.27216US $8.16
100+US $0.21773US $21.77
500+US $0.19958US $99.79
1000+US $0.18144US $181.44

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Description

The 74HCT541D from Toshiba is a powerful little integrated circuit (IC) that excels in the realm of buffering and line driving. Let's dive into its key features and capabilities:

Function:

  • Non-inverting buffer: It amplifies and replicates the digital signal at its input without changing its logic state (a 0 remains a 0, and a 1 remains a 1).
  • 8-bit operation: Handles eight separate digital signals simultaneously.
  • 3-state outputs: Each output can be switched to a high-impedance state, effectively disconnecting it from the circuit, which is useful for data routing and preventing signal conflicts.

Key Specifications:

  • Package: SOIC20 (20-pin surface-mount package)
  • Logic family: HCT (High-speed CMOS with TTL compatibility)
  • Supply voltage: 4.5V to 5.5V (operates within the range of common TTL and CMOS logic levels)
  • Output current: 4mA (sufficient to drive multiple logic gates)
  • Propagation delay: 13ns (fast signal transmission for real-time applications)
  • Operating temperature range: -40°C to +125°C (suitable for harsh environments)

Benefits:

  • Improves signal strength: Boosts weak signals and ensures clean, reliable transmission over longer distances.
  • Fan-out capability: Drives multiple logic gates without signal degradation.
  • Reduces crosstalk: Isolates signals from each other to prevent interference.
  • Compact and efficient: Small size and low power consumption make it ideal for space-constrained and battery-powered devices.

Applications:

  • Digital signal buffering: Amplifying weak signals or driving long signal lines.
  • Bus interfacing: Connecting devices with different logic levels or impedances.
  • Data distribution: Distributing digital signals to multiple destinations.
  • Fan-out expansion: Increasing the number of devices a single signal can drive.
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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