74HCT541D
- Manufacturer's Part No.:74HCT541D
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- Series:74HCT
- Description:IC BUF NON-INVERT 5.5V 20SOIC
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- Available: 32000
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $0.54432 | US $0.54 |
10+ | US $0.36288 | US $3.63 |
30+ | US $0.27216 | US $8.16 |
100+ | US $0.21773 | US $21.77 |
500+ | US $0.19958 | US $99.79 |
1000+ | US $0.18144 | US $181.44 |
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- Description
- Alternatives
- Shopping Guide
The 74HCT541D from Toshiba is a powerful little integrated circuit (IC) that excels in the realm of buffering and line driving. Let's dive into its key features and capabilities:
Function:
- Non-inverting buffer: It amplifies and replicates the digital signal at its input without changing its logic state (a 0 remains a 0, and a 1 remains a 1).
- 8-bit operation: Handles eight separate digital signals simultaneously.
- 3-state outputs: Each output can be switched to a high-impedance state, effectively disconnecting it from the circuit, which is useful for data routing and preventing signal conflicts.
Key Specifications:
- Package: SOIC20 (20-pin surface-mount package)
- Logic family: HCT (High-speed CMOS with TTL compatibility)
- Supply voltage: 4.5V to 5.5V (operates within the range of common TTL and CMOS logic levels)
- Output current: 4mA (sufficient to drive multiple logic gates)
- Propagation delay: 13ns (fast signal transmission for real-time applications)
- Operating temperature range: -40°C to +125°C (suitable for harsh environments)
Benefits:
- Improves signal strength: Boosts weak signals and ensures clean, reliable transmission over longer distances.
- Fan-out capability: Drives multiple logic gates without signal degradation.
- Reduces crosstalk: Isolates signals from each other to prevent interference.
- Compact and efficient: Small size and low power consumption make it ideal for space-constrained and battery-powered devices.
Applications:
- Digital signal buffering: Amplifying weak signals or driving long signal lines.
- Bus interfacing: Connecting devices with different logic levels or impedances.
- Data distribution: Distributing digital signals to multiple destinations.
- Fan-out expansion: Increasing the number of devices a single signal can drive.
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
SHIPPING GUIDE
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Shipping Cost
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Delivery Time
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