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AM4377BZDNA100

  • In Stock: 1500
  • Available: 885

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $39.52872US $39.53
10+US $29.64654US $296.47
30+US $25.69367US $770.81
100+US $22.72901US $2272.90
500+US $21.34551US $10672.76
1000+US $19.76436US $19764.36

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Description

The AM4377BZDNA100 is a highly integrated system-on-chip (SoC) designed by Texas Instruments, primarily aimed at industrial and embedded applications. This device is part of the AM437x family of processors, which are based on the ARM Cortex-A9 architecture. Here’s a detailed description of its features and specifications:

Core Architecture

  • Processor: The AM4377 features a dual-core ARM Cortex-A9 processor, which operates at a clock speed of up to 1 GHz. This architecture provides a balance of performance and power efficiency, making it suitable for a variety of applications.
  • Floating Point Unit (FPU): The Cortex-A9 includes a hardware floating-point unit, enhancing the performance of applications that require complex mathematical computations.

Memory and Storage

  • Memory Interface: The SoC supports various memory types, including DDR3/DDR3L and DDR2 SDRAM, allowing for flexible memory configurations. It can address up to 1 GB of RAM.
  • Flash Memory: The AM4377 supports multiple flash memory interfaces, including NAND and NOR flash, enabling robust storage solutions for embedded applications.

Connectivity

  • Ethernet: The device includes a 10/100/1000 Mbps Ethernet MAC, which is essential for networked applications, allowing for high-speed data transfer.
  • USB: It features USB 2.0 interfaces, including host and device modes, facilitating connectivity with a wide range of peripherals.
  • Serial Interfaces: The AM4377 provides multiple serial communication interfaces, including UART, SPI, and I2C, which are crucial for connecting to sensors and other devices in embedded systems.

Graphics and Multimedia

  • Graphics Processing: The SoC includes a 2D graphics accelerator, which can handle basic graphics tasks, making it suitable for applications that require a graphical user interface.
  • Video Processing: It supports video processing capabilities, allowing for the playback and manipulation of video streams, which is beneficial in multimedia applications.

Power Management

  • Power Efficiency: The AM4377 is designed with power efficiency in mind, featuring various power management modes to reduce energy consumption during idle periods.
  • Operating Voltage: The device operates within a voltage range of 1.1V to 1.3V for the core, and it supports a wide range of I/O voltages, making it adaptable to different power supply designs.

Development and Support

  • Software Support: Texas Instruments provides extensive software support for the AM4377, including a Linux-based SDK, which simplifies the development process for engineers and developers.
  • Development Tools: The device is compatible with various development tools and platforms, including TI’s Code Composer Studio, enabling efficient software development and debugging.

Applications

The AM4377 is well-suited for a variety of applications, including:

  • Industrial automation and control systems
  • Human-machine interfaces (HMIs)
  • Medical devices
  • Robotics
  • Smart grid and energy management systems

Package and Dimensions

  • Package Type: The AM4377BZDNA100 is typically available in a BGA (Ball Grid Array) package, which allows for a compact design and efficient thermal management.
  • Dimensions: The specific dimensions of the package can vary, but BGA packages are generally designed to optimize space on printed circuit boards (PCBs).

In summary, the AM4377BZDNA100 from Texas Instruments is a versatile and powerful SoC that combines high performance with low power consumption, making it an excellent choice for a wide range of embedded and industrial applications. Its rich set of features, including robust connectivity options and extensive software support, positions it as a strong candidate for developers looking to create innovative solutions in the embedded space.

Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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