DIR9001PW
- Manufacturer's Part No.:DIR9001PW
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- Description:IC DGTL AUDIO IR RCVR 28-TSSOP
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- In Stock: 200000
- Available: 18555
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $90.00000 | US $90.00 |
10+ | US $70.00000 | US $700.00 |
30+ | US $60.00000 | US $1800.00 |
100+ | US $55.00000 | US $5500.00 |
500+ | US $53.00000 | US $26500.00 |
1000+ | US $50.00000 | US $50000.00 |
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- Description
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The S29GL256/128/064/032M family of devices are 3.0 V single power Flash memory manufactured using 0.23 µm MirrorBit technology.
The S29GL256M is a 256†Mbit, organized as 16,777,216 words or 33,554,432 bytes.
The S29GL128M is a 128 Mbit, organized as 8,388,608 words or 16,777,216 bytes.
The S29GL064M is a 64 Mbit, organized as 4,194,304 words or 8,388,608 bytes.
The S29GL032M is a 32 Mbit, organized as 2,097,152 words or 4,194,304 bytes. Depending on the model number, the devices have an 8-bit wide data bus only, 16-bit wide data bus only, or a 16-bit wide data bus that can also function as an 8-bit wide data bus by using the BYTE# input.
The devices can be programmed either in the host system or in standard EPROM programmers.Distinctive CharacteristicsArchitectural Advantages
• Single power supply operation — 3 volt read, erase, and program operations
• Manufactured on 0.23 µm MirrorBit process technology
• Secured Silicon Sector region — 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random Electronic Serial Number, accessible through a command sequence — May be programmed and locked at the factory or by the customer
• Flexible sector architecture — 256 Mb: 512 32-Kword (64 Kbyte) sectors — 128 Mb: 256 32-Kword (64 Kbyte) sectors — 64 Mb (uniform sector models): 128 32-Kword (64-Kbyte) sectors or 128 32 Kword sectors — 64 Mb (boot sector models): 127 32-Kword (64-Kbyte) sectors + 8 4Kword (8Kbyte) boot sectors — 32 Mb (uniform sector models): 64 32-Kword (64-Kbyte) sectors of 64 32-Kword sectors — 32 Mb (boot sector models): 63 32-Kword (64 Kbyte) sectors + 8 4-Kword (8-Kbyte) boot sectors
• Compatibility with JEDEC standards — Provides pinout and software compatibility for single power supply flash, and superior inadvertent write protection
• 100,000 erase cycles typical per sector
• 20-year data retention typicalPerformance Characteristics
• High performance — 90 ns access time (128 Mb, 64 Mb, 32 Mb), 100 ns access time (256 Mb) — 4-word/8-byte page read buffer — 25 ns page read times (128 Mb, 64 Mb, 32 Mb) — 30 ns page read times (256 Mb) — 16-word/32-byte write buffer — 16-word/32-byte write buffer reduces overall programming time for multiple-word updates
• Low power consumption (typical values at 3.0 V, 5 MHz) — 18 mA typical active read current (64 Mb, 32 Mb) — 25 mA typical active read current (256 Mb, 128 Mb) — 50 mA typical erase/program current — 1 µA typical standby mode current
• Package options — 40-pin TSOP — 48-pin TSOP — 56-pin TSOP — 64-ball Fortified BGA — 48-ball fine-pitch BGA — 63-ball fine-pitch BGASoftware & Hardware
Features
• Software features — Program Suspend & Resume: read other sectors before programming operation is completed — Erase Suspend & Resume: read/program other sectors before an erase operation is completed — Data# polling & toggle bits provide status — CFI (Common Flash Interface) compliant: allows host system to identify and accommodate multiple flash devices — Unlock Bypass Program command reduces overall multiple-word programming time
• Hardware features — Sector Group Protection: hardware-level method of preventing write operations within a sector group — Temporary Sector Unprotect: VID-level method of charging code in locked sectors — WP#/ACC input accelerates programming time (when high voltage is applied) for greater throughput during system production. Protects first or last sector regardless of sector protection settings on uniform sector models — Hardware reset input (RESET#) resets device — Ready/Busy# output (RY/BY#) detects program or erase cycle completion
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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