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DS21FT42

  • Available: 5941

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.00000US $0.00

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  • Description
  • Alternatives
  • Shopping Guide
Description
MULTI-CHIP MODULE (MCM)
The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1.
FEATURES
• Sixteen (16) or Twelve (12) Completely Independent T1 Framers in One Small 27mm x 27mm Package
• Each Multi-Chip Module (MCM) Contains Four (FF) or Three (FT) DS21Q42 Die.
• Each Quad Framer Can be Concatenated into a Single 8.192MHz Backplane Data Stream
• IEEE 1149.1 JTAG-Boundary Scan Architecture
• DS21FF42 and DS21FT42 are Pin Compatible with DS21FF44 and DS21FT44, respectively, to allow the Same Footprint to Support T1 and E1 Applications
• 300–pin MCM BGA package (27mm X 27mm)
• Low Power 3.3V CMOS with 5V Tolerant Input & Outputs
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

SHIPPING GUIDE

  • Shipping Methods

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  • Shipping Cost

    Shipping starts at $40 but varies for destinations like South Africa, Brazil, India, and more. The actual shipping charges depend on time zone, country, and package weight/volume.

  • Delivery Time

    We ship orders once daily, around 5 p.m., except on Sundays. The estimated delivery time may vary depending on the courier service you choose, but typically ranges from 5 to 7 business days.

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