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FT232RNL-REEL
- Manufacturer’s Part#:FT232RNL-REEL
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- Description:UART Interface IC USB Full Speed to Serial UART IC, Includes Oscillator and EEPROM, SSOP-28
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- Quantity:Buy NowAdd to Cart
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- In Stock: 20000
- Available: 9413
- Updated: 1 hr ago
Reference Price(In US Dollars)
| Qty | Unit Price | Ext.Price |
|---|---|---|
| 1+ | US $4.62000 | US $4.62 |
| 10+ | US $4.15800 | US $41.58 |
| 30+ | US $3.23400 | US $97.02 |
| 100+ | US $2.65650 | US $265.65 |
| 500+ | US $2.54100 | US $1270.50 |
| 1000+ | US $2.31000 | US $2310.00 |
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- Description
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- Shopping Guide
The FT232RNL is a USB to serial UART interface integrated circuit (IC) designed for embedded applications. It features a full-speed USB interface (12 Mbps) and a standard UART interface (up to 3 Mbps). The chip also includes an internal oscillator, EEPROM for storing configuration data, and various additional features like clock generation output and FTDIChip-ID™ security dongle feature.
Key Features:
USB to serial UART interface
Full-speed USB interface (12 Mbps)
Standard UART interface (up to 3 Mbps)
Internal oscillator for ease of use
EEPROM for storing configuration data
Clock generation output for external devices
FTDIChip-ID™ security dongle feature for enhanced security
SSOP-28 package
Applications:
The FT232RNL is a versatile IC suitable for various applications, including:
Industrial automation and control systems
Data acquisition and logging
Point-of-sale (POS) systems
Medical devices
Programming and debugging microcontrollers
Custom embedded designs
Benefits:
Ease of use: The internal oscillator and EEPROM simplify integration into designs.
Cost-effective: The chip is relatively affordable, making it suitable for cost-sensitive applications.
Versatility: The wide range of features and supported protocols make it suitable for various applications.
Reliability: FTDI chips are known for their reliability and performance.
Technical Specifications:
Supply voltage: 3.3 V or 5 V
Operating temperature: -40°C to +85°C
Package: SSOP-28
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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