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LC4032V-5T44I

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  • Description
  • Alternatives
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Description
ispMACH 4000 Introduction
The high performance ispMACH 4000 family from Lattice offers a SuperFAST CPLD solution.
The family is a blend of Lattice’s two most popular architectures: the ispLSI® 2000 and ispMACH 4A. Retaining the best of both families, the ispMACH 4000 architecture focuses on significant innovations to combine the highest performance with low power in a flexible CPLD family.
Features
• High Performance
• fMAX = 400MHz maximum operating frequency
• tPD = 2.5ns propagation delay
• Up to four global clock pins with programmable clock polarity control
• Up to 80 PTs per output
• Ease of Design
• Enhanced macrocells with individual clock, reset, preset and clock enable controls
• Up to four global OE controls
• Individual local OE control per I/O pin
• Excellent First-Time-FitTM and refit
• Fast path, SpeedLockingTM Path, and wide-PT path
• Wide input gating (36 input logic blocks) for fast counters, state machines and address decoders
• Zero Power (ispMACH 4000Z) and Low Power (ispMACH 4000V/B/C)
• Typical static current 10µA (4032Z)
• Typical static current 1.3mA (4000C)
• 1.8V core low dynamic power
• ispMACH 4000Z operational down to 1.6V VCC
• Broad Device Offering
• Multiple temperature range support
– Commercial: 0 to 90°C junction (Tj)
– Industrial: -40 to 105°C junction (Tj)
– Extended: -40 to 130°C junction (Tj)
• For AEC-Q100 compliant devices, refer to LA-ispMACH 4000V/Z Automotive Data Sheet
• Easy System Integration
• Superior solution for power sensitive consumer applications
• Operation with 3.3V, 2.5V or 1.8V LVCMOS I/O
• Operation with 3.3V (4000V), 2.5V (4000B) or 1.8V (4000C/Z) supplies
• 5V tolerant I/O for LVCMOS 3.3, LVTTL, and PCI interfaces
• Hot-socketing
• Open-drain capability
• Input pull-up, pull-down or bus-keeper
• Programmable output slew rate
• 3.3V PCI compatible
• IEEE 1149.1 boundary scan testable
• 3.3V/2.5V/1.8V In-System Programmable (ISP™) using IEEE 1532 compliant interface
• I/O pins with fast setup path
• Lead-free package options
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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