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LC4064ZE-7TN48I

  • In Stock: 3600
  • Available: 250

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $5.42028US $5.42
10+US $4.87825US $48.78
30+US $3.79420US $113.83
100+US $3.11666US $311.67
500+US $2.98115US $1490.58
1000+US $2.71014US $2710.14

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Description
Description
The high performance ispMACH 4000ZE family from Lattice offers an ultra low power CPLD solution.
The new family is based on Lattice’s industry-leading ispMACH 4000 architecture. Retaining the best of the previous generation, the ispMACH 4000ZE architecture focuses on significant innovations to combine high performance with low power in a flexible CPLD family. For example, the family’s new Power Guard feature minimizes dynamic power consumption by preventing internal logic toggling due to unnecessary I/O pin activity.
The ispMACH 4000ZE combines high speed and low power with the flexibility needed for ease of design. With its robust Global Routing Pool and Output Routing Pool, this family delivers excellent First-Time-Fit, timing predictability, routing, pin-out retention and density migration.
The ispMACH 4000ZE family offers densities ranging from 32 to 256 macrocells.
There are multiple density-I/O combinations in Thin Quad Flat Pack (TQFP), Chip Scale BGA (csBGA), and Ultra Chip Scale BGA (ucBGA) packages ranging from 32 to 144 pins/balls. Table 1 shows the macrocell, package and I/O options, along with other key parameters. A user programmable internal oscillator and a timer are included in the device for tasks like LED control, keyboard scanner and similar housekeeping type state machines. This feature can be optionally disabled to save power.
The ispMACH 4000ZE family has enhanced system integration capabilities. It supports a 1.8 V supply voltage and 3.3 V, 2.5 V, 1.8 V and 1.5 V interface voltages. Additionally, inputs can be safely driven up to 5.5 V when an I/O bank is configured for 3.3 V operation, making this family 5 V tolerant.
The ispMACH 4000ZE also offers enhanced I/O features such as slew rate control, PCI compatibility, bus-keeper latches, pull-up resistors, pull-down resistors, open drain outputs and hot socketing. Pull-up, pull-down and bus-keeper features are controllable on a “per-pin” basis.
The ispMACH 4000ZE family members are 1.8 V in-system programmable through the IEEE Standard 1532 interface. IEEE Standard 1149.1 boundary scan testing capability also allows product testing on automated test equipment.
The 1532 interface signals TCK, TMS, TDI and TDO are referenced to VCC (logic core).  
Features
• High Performance
• fMAX = 260MHz maximum operating frequency
• tPD = 4.4ns propagation delay
• Up to four global clock pins with programmable clock polarity control
• Up to 80 PTs per output
• Ease of Design
• Flexible CPLD macrocells with individual clock, reset, preset and clock enable controls
• Up to four global OE controls
• Individual local OE control per I/O pin
• Excellent First-Time-FitTM and refit
• Wide input gating (36 input logic blocks) for fast counters, state machines and address decoders
• Ultra Low Power
• Standby current as low as 10µA typical
• 1.8V core; low dynamic power
• Operational down to 1.6V VCC
• Superior solution for power sensitive consumer applications
• Per pin pull-up, pull-down or bus keeper control
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• Power Guard with multiple enable signals
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• Broad Device Offering
• 32 to 256 macrocells
• Multiple temperature range support– Commercial: 0 to 90°C junction (Tj)– Industrial: -40 to 105°C junction (Tj)
• Space-saving packages
• Easy System Integration
• Operation with 3.3V, 2.5V, 1.8V or 1.5V LVCMOS I/O
• 5V tolerant I/O for LVCMOS 3.3, LVTTL, and PCI interfaces
• Hot-socketing support
• Open-drain output option
• Programmable output slew rate
• 3.3V PCI compatible
• I/O pins with fast setup path
• Input hysteresis
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• 1.8V core power supply
• IEEE 1149.1 boundary scan testable
• IEEE 1532 ISC compliant
• 1.8V In-System Programmable (ISP™) using Boundary Scan Test Access Port (TAP)
• Pb-free package options (only)
• On-chip user oscillator and timer
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Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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