LCMXO2280C-3TN144I
- Manufacturer's Part No.:LCMXO2280C-3TN144I
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- Series:MachXO
- Description:IC FPGA 113 I/O 144TQFP
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- Quantity:Buy NowAdd to Cart
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- In Stock: 600
- Available: 4257
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $20.60000 | US $20.60 |
10+ | US $15.45000 | US $154.50 |
30+ | US $13.39000 | US $401.70 |
100+ | US $11.84500 | US $1184.50 |
500+ | US $11.12400 | US $5562.00 |
1000+ | US $10.30000 | US $10300.00 |
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- Description
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- Shopping Guide
The MachXO is optimized to meet the requirements of applications traditionally addressed by CPLDs and low capacity FPGAs: glue logic, bus bridging, bus interfacing, power-up control, and control logic.
These devices bring together the best features of CPLD and FPGA devices on a single chip.
The devices use look-up tables (LUTs) and embedded block memories traditionally associated with FPGAs for flexible and efficient logic implementation. Through non-volatile technology, the devices provide the single-chip, highsecurity, instant-on capabilities traditionally associated with CPLDs. Finally, advanced process technology and careful design will provide the high pin-to-pin performance also associated with CPLDs.
The ispLEVER® design tools from Lattice allow complex designs to be efficiently implemented using the MachXO family of devices. Popular logic synthesis tools provide synthesis library support for MachXO.
The ispLEVER tools use the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the MachXO device.
The ispLEVER tool extracts the timing from the routing and back-annotates it into the design for timing verification.
Features
• Non-volatile, Infinitely Reconfigurable
• Instant-on
– powers up in microseconds
• Single chip, no external configuration memory required
• Excellent design security, no bit stream to intercept
• Reconfigure SRAM based logic in milliseconds
• SRAM and non-volatile memory programmable through JTAG port
• Supports background programming of non-volatile memory
• Sleep Mode
• Allows up to 100x static current reduction
• TransFR™ Reconfiguration (TFR)
• In-field logic update while system operates
• High I/O to Logic Density
• 256 to 2280 LUT4s
• 73 to 271 I/Os with extensive package options
• Density migration supported
• Lead free/RoHS compliant packaging
• Embedded and Distributed Memory
• Up to 27.6 Kbits sysMEM™ Embedded Block RAM
• Up to 7.5 Kbits distributed RAM
• Dedicated FIFO control logic
• Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide range of interfaces:− LVCMOS 3.3/2.5/1.8/1.5/1.2− LVTTL− PCI− LVDS, Bus-LVDS, LVPECL, RSDS
• sysCLOCK™ PLLs
• Up to two analog PLLs per device
• Clock multiply, divide, and phase shifting
• System Level Support
• IEEE Standard 1149.1 Boundary Scan
• Onboard oscillator
• Devices operate with 3.3V, 2.5V, 1.8V or 1.2V power supply
• IEEE 1532 compliant in-system programming
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
SHIPPING GUIDE
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Shipping Cost
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Delivery Time
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