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LP5912Q3.3DRVRQ1

  • In Stock: 115678
  • Available: 160965

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $1.27050US $1.27
10+US $0.84700US $8.47
30+US $0.63525US $19.06
100+US $0.50820US $50.82
500+US $0.46585US $232.92
1000+US $0.42350US $423.50

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Description
Description
The LP5912-Q1 is low-noise LDO that can supply up to 500 mA of output current. Designed to meet the requirements of RF and analog circuits, the LP5912-Q1 device provides low noise, high PSRR, low quiescent current, and low line and load transient response.
The LP5912-Q1 offers class-leading noise performance without a noise bypass capacitor and with the ability for remote output capacitance placement.
The device is designed to work with a 1-µF input and a 1-µF output ceramic capacitor (no separate noise bypass capacitor required). This device is available with fixed output voltages from 0.8 V to 5.5 V in 25-mV steps. Contact Texas Instruments Sales for specific voltage option needs.  
Features
• Qualified for Automotive Applications
• AEC Q100-Qualified With the Following Results– Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range– Device HBM Classification Level 2– Device CDM Classification Level C6
• Input Voltage Range: 1.6 V to 6.5 V
• Output Voltage Range: 0.8 V to 5.5 V
• Output Current up to 500 mA
• Low Output-Voltage Noise: 12 µVRMS Typical
• PSRR at 1 kHz: 75 dB Typical
• Output Voltage Tolerance (VOUT ≥ 3.3 V): ±2%
• Low IQ (Enabled, No Load): 30 µA Typical
• Low Dropout (VOUT ≥ 3.3 V): 95 mV Typical at 500-mA Load
• Stable With 1-µF Ceramic Input and Output Capacitors

Thermal-Overload and Short-Circuit Protection
• Reverse Current Protection
• No Noise Bypass Capacitor Required
• Output Automatic Discharge for Fast Turnoff
• Power-Good Output With 140-µs Typical Delay
• Internal Soft-Start to Limit the In-rush Current
• –40°C to +125°C Operating Junction Temperature Range   Applications
• Automotive Infotainment
• Telematics Systems
• ADAS Cameras and Radar
• Navigation Systems
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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