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M29DW323DT70N6E

  • In Stock: 113959
  • Available: 5103

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $3.57000US $3.57
10+US $3.21300US $32.13
30+US $2.49900US $74.97
100+US $2.05275US $205.28
500+US $1.96350US $981.75
1000+US $1.78500US $1785.00

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  • Description
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Description

The M29DW323DT70N6E is a specific model of flash memory chip produced by Micron Technology, a leading manufacturer in the semiconductor industry. This chip is part of the NAND flash memory family, which is widely used in various applications, including consumer electronics, automotive systems, and industrial devices.

Key Features:

  1. Memory Type: The M29DW323DT70N6E is a NOR flash memory device, which allows for random access to data, making it suitable for applications that require fast read speeds and the ability to execute code directly from the memory.

  2. Storage Capacity: This particular model offers a storage capacity of 32 megabits (Mb), which is equivalent to 4 megabytes (MB). This capacity is suitable for storing firmware, boot code, and other essential data in embedded systems.

  3. Interface: The chip utilizes a parallel interface, which allows for high-speed data transfer between the memory and the host system. This interface is compatible with various microcontrollers and processors, making it versatile for different applications.

  4. Access Times: The M29DW323DT70N6E features fast access times, typically around 70 nanoseconds, which enables quick read operations. This is particularly beneficial in applications where speed is critical, such as in boot processes or real-time data processing.

  5. Voltage Range: The device operates within a voltage range of 2.7V to 3.6V, making it suitable for low-power applications. This voltage range helps in reducing power consumption, which is essential for battery-operated devices.

  6. Endurance and Reliability: The M29DW323DT70N6E is designed for high endurance, with the ability to withstand a significant number of program/erase cycles (typically around 10,000 cycles). This durability is crucial for applications that require frequent updates to the stored data.

  7. Package Type: The chip is available in various package types, including TSOP (Thin Small Outline Package) and BGA (Ball Grid Array), allowing for flexibility in design and integration into different circuit boards.

  8. Temperature Range: The device is rated for operation in a wide temperature range, making it suitable for both consumer and industrial applications. This ensures reliable performance in various environmental conditions.

Applications:

The M29DW323DT70N6E is commonly used in applications such as:

  • Embedded Systems: Ideal for storing firmware and boot code in microcontrollers.
  • Consumer Electronics: Utilized in devices like digital cameras, set-top boxes, and gaming consoles.
  • Automotive: Employed in automotive control systems and infotainment units.
  • Industrial Equipment: Used in programmable logic controllers (PLCs) and other industrial automation devices.

Conclusion:

The M29DW323DT70N6E from Micron Technology is a reliable and efficient NOR flash memory solution, offering a balance of performance, endurance, and versatility for a wide range of applications. Its features make it a suitable choice for designers looking to implement robust memory solutions in their electronic products.

Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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