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P82B96PWG4

  • In Stock: 31692
  • Available: 300

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $5.90154US $5.90
10+US $5.31139US $53.11
30+US $4.13108US $123.93
100+US $3.39339US $339.34
500+US $3.24585US $1622.93
1000+US $2.95077US $2950.77

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Description

The P82B96 is a bipolar IC that creates a non-latching, bi-directional, logic interface between the normal I2C-bus and a range of other bus configurations. It can interface I2C-bus logic signals to similar buses having different voltage and current levels. For example it can interface to the 350 µA SMB bus, to 3.3 V logic devices, and to 15 V levels and/or low impedance lines to improve noise immunity on longer bus lengths.
FEATURES
• Bi-directional data transfer of I2C-bus signals
• Isolates capacitance allowing 400 pF on Sx/Sy side and 4000 pF on Tx/Ty side
• Tx/Ty outputs have 60 mA sink capability for driving low impedance or high capacitive buses
• 400 kHz operation over at least 20 meters of wire (see AN10148)
• Supply voltage range of 2 V to 15 V with I2C logic levels on Sx/Sy side independent of supply voltage
• Splits I2C signal into pairs of forward/reverse Tx/Rx, Ty/Ry signals for interface with opto-electrical isolators and similar devices that need uni-directional input and output signal paths.
• Low power supply current
• ESD protection exceeds 3500 V HBM per JESD22-A114, 250 V DIP package / 400 V SO package MM per JESD22-A115, and 1000 V CDM per JESD22-C101
• Latch-up free (bipolar process with no latching structures)
• Packages offered: DIP, SO, and TSSOP TYPICAL APPLICATIONS
• Interface between I2C buses operating at different logic levels (e.g., 5 V and 3 V or 15 V)
• Interface between I2C and SMB (350 µA) bus standard.
• Simple conversion of I2C SDA or SCL signals to multi-drop differential bus hardware, e.g., via compatible PCA82C250.
• Interfaces with Opto-couplers to provide Opto isolation between I2C-bus nodes up to 400 kHz.
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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