P82B96PWR
- Manufacturer's Part No.:P82B96PWR
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- Description:IC REDRIVER I2C 1CH 8TSSOP
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- In Stock: 20000
- Available: 1885
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $4.66000 | US $4.66 |
10+ | US $4.19400 | US $41.94 |
30+ | US $3.26200 | US $97.86 |
100+ | US $2.67950 | US $267.95 |
500+ | US $2.56300 | US $1281.50 |
1000+ | US $2.33000 | US $2330.00 |
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The P82B96 is a bipolar IC that creates a non-latching, bi-directional, logic interface between the normal I2C-bus and a range of other bus configurations. It can interface I2C-bus logic signals to similar buses having different voltage and current levels. For example it can interface to the 350 µA SMB bus, to 3.3 V logic devices, and to 15 V levels and/or low impedance lines to improve noise immunity on longer bus lengths.
FEATURES
• Bi-directional data transfer of I2C-bus signals
• Isolates capacitance allowing 400 pF on Sx/Sy side and 4000 pF on Tx/Ty side
• Tx/Ty outputs have 60 mA sink capability for driving low impedance or high capacitive buses
• 400 kHz operation over at least 20 meters of wire (see AN10148)
• Supply voltage range of 2 V to 15 V with I2C logic levels on Sx/Sy side independent of supply voltage
• Splits I2C signal into pairs of forward/reverse Tx/Rx, Ty/Ry signals for interface with opto-electrical isolators and similar devices that need uni-directional input and output signal paths.
• Low power supply current
• ESD protection exceeds 3500 V HBM per JESD22-A114, 250 V DIP package / 400 V SO package MM per JESD22-A115, and 1000 V CDM per JESD22-C101
• Latch-up free (bipolar process with no latching structures)
• Packages offered: DIP, SO, and TSSOP TYPICAL APPLICATIONS
• Interface between I2C buses operating at different logic levels (e.g., 5 V and 3 V or 15 V)
• Interface between I2C and SMB (350 µA) bus standard.
• Simple conversion of I2C SDA or SCL signals to multi-drop differential bus hardware, e.g., via compatible PCA82C250.
• Interfaces with Opto-couplers to provide Opto isolation between I2C-bus nodes up to 400 kHz.
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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