SN74LVC16374DGGR
- Manufacturer's Part No.:SN74LVC16374DGGR
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- Series:74LVC
- Description:IC FF D-TYPE DUAL 8BIT 48TSSOP
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- In Stock: 169976
- Available: 2000
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $1.50912 | US $1.51 |
10+ | US $1.00608 | US $10.06 |
30+ | US $0.75456 | US $22.64 |
100+ | US $0.60365 | US $60.37 |
500+ | US $0.55334 | US $276.67 |
1000+ | US $0.50304 | US $503.04 |
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- Description
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The SN74LVC16374 is particularly suitable for implementing buffer registers, l/0 ports, bidirectional bus drivers, and working registers. It can be used as two 8-bit fip-flops or one 16-bit fip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs. A buffered outputenable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.
The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components. OE does not affect intermal operations of the fip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to Vcc through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN74LVC16374 is characterized for operation from - 40°C to 85°C.
Features ●Member of the Texas Instruments WidebusTM Family●EPIC TM (Enhanced-Performance Implanted CMOS) Submicron Process●Typical VoLp (Output Ground Bounce) < 0.8V at Vcc=3.3 V, TA = 25°C●Typical VoHv (Output VoH Undershoot) > 2V atVcc= 3.3 V, TA = 25°C Latch-Up P erformance Exceeds 250 mA Per JEDEC Standard JESD-17●Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors●Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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