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SN74LVC2G00DCUR

  • In Stock: 60000
  • Available: 498647

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.48510US $0.49
10+US $0.32340US $3.23
30+US $0.24255US $7.28
100+US $0.19404US $19.40
500+US $0.17787US $88.94
1000+US $0.16170US $161.70

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  • esd
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  • iso9001
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Description
Description This dual 2-input positive-NAND gate is designed for 1.65-V to 5.5-V Vcc operation.
The SN74LVC2G00 device performs the Boolean function Y = Ax Bor Y = A+ B in positive logic. NanoFree TM package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using loff.
The loff circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
Features ●Available in the Texas Instruments NanoFreeTM Package●Supports 5-V Vcc Operation●Inputs Accept Voltages to 5.5 V●Max tpd of4.3 ns at3.3 V●Low Power Consumption, 10-μA Max lcc●±24-mA Output Drive at 3.3 V●Typical VoLp (Output Ground Bounce) < 0.8V atVcc= 3.3V, TA = 25°C●Typical VoHv (Output VoH Undershoot) > 2V atVcc=3.3V, TA= 25°C●loff Supports Live Insertion, Partial Power Down Mode, and Back Drive P rotection●L.atch-Up Performance Exceeds 100 mA Per JESD 78, Class |I●ESD Protection Exceeds JESD 22- 2000-V Human-Body Model- 1000-V Charged-Device Model Applications ●IP Phones: Wired and Wireless●Optical Modules●Optical Networking: EPON and Video Over Fiber●Point-to-Point Microwave Backhaul●Power: Telecom DC/DC Module: Analog and Digital●Private Branch Exchanges (PBX)●TETRA Base Exchanges●Telecom Base Band Units●Telecom Shelters: Power Distribution Units (PDU),Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET), Remote Radio Units (RRU), Tower Mounted Amplifiers (TMA)●Vector Signal Analyzers and Generators●Video Conferencing: IP-Based HD●WiMAX and Wireless Infrastructure Equipment●Wireless Communications Testers and Wireless Repeaters●xDSL Modems and DSLAM
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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