SN74LVC2G00DCUR
- Manufacturer's Part No.:SN74LVC2G00DCUR
- Manufacturer:
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- Series:74LVC
- Description:IC GATE NAND 2CH 2-INP US8
- Quantity:Buy NowAdd to Cart
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- In Stock: 60000
- Available: 498647
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $0.48510 | US $0.49 |
10+ | US $0.32340 | US $3.23 |
30+ | US $0.24255 | US $7.28 |
100+ | US $0.19404 | US $19.40 |
500+ | US $0.17787 | US $88.94 |
1000+ | US $0.16170 | US $161.70 |
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- Description
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- Shopping Guide
The SN74LVC2G00 device performs the Boolean function Y = Ax Bor Y = A+ B in positive logic. NanoFree TM package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using loff.
The loff circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
Features ●Available in the Texas Instruments NanoFreeTM Package●Supports 5-V Vcc Operation●Inputs Accept Voltages to 5.5 V●Max tpd of4.3 ns at3.3 V●Low Power Consumption, 10-μA Max lcc●±24-mA Output Drive at 3.3 V●Typical VoLp (Output Ground Bounce) < 0.8V atVcc= 3.3V, TA = 25°C●Typical VoHv (Output VoH Undershoot) > 2V atVcc=3.3V, TA= 25°C●loff Supports Live Insertion, Partial Power Down Mode, and Back Drive P rotection●L.atch-Up Performance Exceeds 100 mA Per JESD 78, Class |I●ESD Protection Exceeds JESD 22- 2000-V Human-Body Model- 1000-V Charged-Device Model Applications ●IP Phones: Wired and Wireless●Optical Modules●Optical Networking: EPON and Video Over Fiber●Point-to-Point Microwave Backhaul●Power: Telecom DC/DC Module: Analog and Digital●Private Branch Exchanges (PBX)●TETRA Base Exchanges●Telecom Base Band Units●Telecom Shelters: Power Distribution Units (PDU),Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET), Remote Radio Units (RRU), Tower Mounted Amplifiers (TMA)●Vector Signal Analyzers and Generators●Video Conferencing: IP-Based HD●WiMAX and Wireless Infrastructure Equipment●Wireless Communications Testers and Wireless Repeaters●xDSL Modems and DSLAM
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
SHIPPING GUIDE
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Shipping Cost
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Delivery Time
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