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TMS320C6670ACYP2

  • In Stock: 4000
  • Available: 389

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $215.25000US $215.25
10+US $186.55000US $1865.50
30+US $169.33000US $5079.90
100+US $154.98000US $15498.00
500+US $150.67500US $75337.50
1000+US $143.50000US $143500.00

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Description

The TMS320C6670ACYP2 is a high-performance digital signal processor (DSP) from Texas Instruments, part of the C66x family of DSPs. This device is designed for demanding applications in telecommunications, industrial automation, and high-performance computing, where processing speed and efficiency are critical.

Key Features:

  1. Architecture: The TMS320C6670 is built on a multi-core architecture, featuring up to 8 cores based on the C66x DSP architecture. Each core is capable of executing multiple instructions per cycle, leveraging a superscalar design that allows for high throughput and efficient processing of complex algorithms.

  2. Processing Speed: The DSP operates at a clock frequency of up to 1.25 GHz, providing substantial computational power for real-time processing tasks. This high clock speed enables the device to handle intensive workloads, such as video processing, audio processing, and advanced signal processing.

  3. Memory: The TMS320C6670ACYP2 includes a large on-chip memory architecture, with support for both local and shared memory. It typically features up to 1 GB of DDR3 memory, which allows for fast data access and storage, essential for high-bandwidth applications.

  4. Connectivity: The device supports various high-speed interfaces, including PCIe, Gigabit Ethernet, and Serial RapidIO, facilitating seamless integration into complex systems and enabling high-speed data transfer between devices.

  5. Power Efficiency: Despite its high performance, the TMS320C6670ACYP2 is designed with power efficiency in mind. It incorporates advanced power management features that allow it to operate effectively in power-sensitive environments, making it suitable for embedded applications.

  6. Development Support: Texas Instruments provides a comprehensive development ecosystem for the TMS320C6670, including software development kits (SDKs), libraries, and tools that simplify the development process. This support helps engineers to quickly prototype and deploy applications.

  7. Applications: The TMS320C6670ACYP2 is ideal for a wide range of applications, including:

    • Telecommunications infrastructure (e.g., base stations, routers)
    • Video and image processing (e.g., video conferencing, surveillance)
    • Industrial automation and control systems
    • Medical imaging and diagnostics
    • Military and aerospace applications

Package and Specifications:

  • Package Type: The TMS320C6670ACYP2 typically comes in a BGA (Ball Grid Array) package, which allows for a compact design and efficient thermal management.
  • Operating Temperature Range: The device is designed to operate in a wide temperature range, making it suitable for various environmental conditions.

Conclusion:

The TMS320C6670ACYP2 from Texas Instruments is a powerful and versatile DSP that meets the needs of high-performance applications across multiple industries. Its combination of multi-core processing, high-speed connectivity, and robust development support makes it an excellent choice for engineers looking to implement advanced signal processing solutions.

Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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