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TMS320C6745DPTPA3

  • In Stock: 1000
  • Available: 1950

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $33.67200US $33.67
10+US $25.25400US $252.54
30+US $21.88680US $656.60
100+US $19.36140US $1936.14
500+US $18.18288US $9091.44
1000+US $16.83600US $16836.00

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Description

The TMS320C6745DPTPA3 is a high-performance digital signal processor (DSP) from Texas Instruments, part of the TMS320C6000 family. This DSP is designed for a wide range of applications, including audio processing, telecommunications, and industrial control systems. Below is a detailed description of its key features and specifications:

General Overview

  • Architecture: The TMS320C6745 is based on a fixed-point and floating-point architecture, which allows it to handle both types of data efficiently. It is optimized for high-performance signal processing tasks.
  • Core: The DSP features a dual-core architecture, which includes a C674x core that supports both fixed-point and floating-point operations, enhancing its versatility in processing complex algorithms.

Performance

  • Clock Speed: The TMS320C6745 operates at a maximum clock frequency of up to 1 GHz, providing substantial processing power for demanding applications.
  • MIPS Performance: It can deliver up to 1,600 MIPS (Million Instructions Per Second) performance, making it suitable for real-time processing tasks.

Memory

  • On-chip Memory: The device includes a significant amount of on-chip memory, which typically consists of:
    • L1 Cache: 32 KB of L1 program cache and 32 KB of L1 data cache, allowing for faster access to frequently used data and instructions.
    • L2 Cache: 256 KB of L2 cache, which further enhances performance by reducing the time needed to access data from external memory.
  • External Memory Interface: The DSP supports various external memory interfaces, including DDR2 and SDRAM, enabling it to connect to larger memory systems for extensive data processing.

Connectivity

  • Peripheral Interfaces: The TMS320C6745 is equipped with multiple peripheral interfaces, including:
    • McBSP (Multichannel Buffered Serial Port): For audio and serial data communication.
    • SPI (Serial Peripheral Interface): For connecting to various peripherals.
    • I2C (Inter-Integrated Circuit): For low-speed communication with sensors and other devices.
    • GPIO (General Purpose Input/Output): For general-purpose control and signaling.

Power Management

  • Power Consumption: The TMS320C6745 is designed with power efficiency in mind, making it suitable for battery-operated devices. It features various power-saving modes to reduce energy consumption during idle periods.
  • Thermal Management: The device is packaged in a thermally efficient manner, allowing it to operate effectively within a wide range of temperatures.

Package

  • Form Factor: The TMS320C6745DPTPA3 is available in a 100-pin TQFP (Thin Quad Flat Package) form factor, which is suitable for surface-mount technology (SMT) applications. This compact package allows for easy integration into various electronic designs.

Applications

The TMS320C6745 is widely used in applications such as:

  • Audio and Speech Processing: For high-fidelity audio applications, including voice recognition and synthesis.
  • Image and Video Processing: In systems requiring real-time image analysis and video encoding/decoding.
  • Telecommunications: For signal processing in wireless communication systems.
  • Industrial Automation: In control systems for robotics and automation equipment.

Conclusion

The TMS320C6745DPTPA3 from Texas Instruments is a powerful and versatile DSP that combines high performance with efficient power management, making it an ideal choice for a variety of demanding applications in the fields of audio, telecommunications, and industrial control. Its advanced architecture and extensive peripheral support enable developers to create innovative solutions tailored to their specific needs.

Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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