TMS320C6747DZKB3
- Manufacturer's Part No.:TMS320C6747DZKB3
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- Series:TMS320C674x
- Description:IC DSP FIX/FLOAT POINT 256BGA
- Quantity:Buy NowAdd to Cart
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- In Stock: 2000
- Available: 4960
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $40.06000 | US $40.06 |
10+ | US $30.04500 | US $300.45 |
30+ | US $26.03900 | US $781.17 |
100+ | US $23.03450 | US $2303.45 |
500+ | US $21.63240 | US $10816.20 |
1000+ | US $20.03000 | US $20030.00 |
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The TMS320C6747DZKB3 is a high-performance digital signal processor (DSP) from Texas Instruments, part of the TMS320C6000 family. This DSP is designed for a wide range of applications, including audio processing, telecommunications, and industrial control systems. Below is a detailed description of its key features and specifications:
Architecture and Performance
- Core Architecture: The TMS320C6747 features a fixed-point and floating-point DSP architecture, which allows it to efficiently handle both types of computations. It is based on the C674x core, which is optimized for high-performance signal processing tasks.
- Clock Speed: The device operates at a maximum clock frequency of 456 MHz, enabling it to perform complex calculations quickly and efficiently.
- Instruction Set: It supports a rich instruction set that includes both single-cycle and multi-cycle instructions, enhancing its ability to execute complex algorithms.
Memory
- On-Chip Memory: The TMS320C6747 includes a combination of on-chip SRAM and cache memory, which provides fast access to frequently used data and instructions, improving overall processing speed.
- External Memory Interface: It supports various external memory interfaces, including DDR2 and SDRAM, allowing for flexible memory expansion and integration with other system components.
Connectivity
- Peripheral Interfaces: The DSP is equipped with multiple peripheral interfaces, including:
- McBSP (Multichannel Buffered Serial Port): For audio and serial data communication.
- SPI (Serial Peripheral Interface): For connecting to various peripherals.
- I2C (Inter-Integrated Circuit): For low-speed communication with sensors and other devices.
- GPIO (General Purpose Input/Output): For general-purpose control and signaling.
- EMIF (External Memory Interface): This allows for connection to external memory devices, enhancing the system's memory capabilities.
Power Management
- Power Consumption: The TMS320C6747 is designed with power efficiency in mind, making it suitable for battery-operated devices. It features various power-saving modes to reduce energy consumption during idle periods.
- Operating Voltage: The device typically operates at a voltage range of 1.2V to 1.3V, which is standard for modern DSPs, contributing to its low power profile.
Package and Thermal Characteristics
- Package Type: The TMS320C6747DZKB3 is available in a BGA (Ball Grid Array) package, which provides a compact footprint and efficient thermal management.
- Thermal Performance: The device is designed to operate within a specified temperature range, making it suitable for various environmental conditions.
Applications
The TMS320C6747 is widely used in applications such as:
- Audio Processing: For high-fidelity audio applications, including digital audio effects and mixing.
- Telecommunications: In systems requiring signal processing for voice and data transmission.
- Industrial Automation: For real-time control and monitoring in industrial systems.
- Medical Devices: In imaging and diagnostic equipment that requires high-speed data processing.
Development Support
Texas Instruments provides extensive development tools and software support for the TMS320C6747, including:
- Code Composer Studio (CCS): An integrated development environment (IDE) for programming and debugging.
- DSP/BIOS: A real-time operating system designed for DSP applications.
- Libraries and Frameworks: Optimized libraries for signal processing, including the DSP Library (DSPLIB) and the Codec Engine.
In summary, the TMS320C6747DZKB3 is a versatile and powerful DSP that combines high performance with low power consumption, making it an excellent choice for a wide range of signal processing applications. Its robust architecture, extensive connectivity options, and strong development support make it a popular choice among engineers and developers in the field.
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
SHIPPING GUIDE
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