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TMS320C6747DZKB3

  • In Stock: 2000
  • Available: 4960

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $40.06000US $40.06
10+US $30.04500US $300.45
30+US $26.03900US $781.17
100+US $23.03450US $2303.45
500+US $21.63240US $10816.20
1000+US $20.03000US $20030.00

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Description

The TMS320C6747DZKB3 is a high-performance digital signal processor (DSP) from Texas Instruments, part of the TMS320C6000 family. This DSP is designed for a wide range of applications, including audio processing, telecommunications, and industrial control systems. Below is a detailed description of its key features and specifications:

Architecture and Performance

  • Core Architecture: The TMS320C6747 features a fixed-point and floating-point DSP architecture, which allows it to efficiently handle both types of computations. It is based on the C674x core, which is optimized for high-performance signal processing tasks.
  • Clock Speed: The device operates at a maximum clock frequency of 456 MHz, enabling it to perform complex calculations quickly and efficiently.
  • Instruction Set: It supports a rich instruction set that includes both single-cycle and multi-cycle instructions, enhancing its ability to execute complex algorithms.

Memory

  • On-Chip Memory: The TMS320C6747 includes a combination of on-chip SRAM and cache memory, which provides fast access to frequently used data and instructions, improving overall processing speed.
  • External Memory Interface: It supports various external memory interfaces, including DDR2 and SDRAM, allowing for flexible memory expansion and integration with other system components.

Connectivity

  • Peripheral Interfaces: The DSP is equipped with multiple peripheral interfaces, including:
    • McBSP (Multichannel Buffered Serial Port): For audio and serial data communication.
    • SPI (Serial Peripheral Interface): For connecting to various peripherals.
    • I2C (Inter-Integrated Circuit): For low-speed communication with sensors and other devices.
    • GPIO (General Purpose Input/Output): For general-purpose control and signaling.
  • EMIF (External Memory Interface): This allows for connection to external memory devices, enhancing the system's memory capabilities.

Power Management

  • Power Consumption: The TMS320C6747 is designed with power efficiency in mind, making it suitable for battery-operated devices. It features various power-saving modes to reduce energy consumption during idle periods.
  • Operating Voltage: The device typically operates at a voltage range of 1.2V to 1.3V, which is standard for modern DSPs, contributing to its low power profile.

Package and Thermal Characteristics

  • Package Type: The TMS320C6747DZKB3 is available in a BGA (Ball Grid Array) package, which provides a compact footprint and efficient thermal management.
  • Thermal Performance: The device is designed to operate within a specified temperature range, making it suitable for various environmental conditions.

Applications

The TMS320C6747 is widely used in applications such as:

  • Audio Processing: For high-fidelity audio applications, including digital audio effects and mixing.
  • Telecommunications: In systems requiring signal processing for voice and data transmission.
  • Industrial Automation: For real-time control and monitoring in industrial systems.
  • Medical Devices: In imaging and diagnostic equipment that requires high-speed data processing.

Development Support

Texas Instruments provides extensive development tools and software support for the TMS320C6747, including:

  • Code Composer Studio (CCS): An integrated development environment (IDE) for programming and debugging.
  • DSP/BIOS: A real-time operating system designed for DSP applications.
  • Libraries and Frameworks: Optimized libraries for signal processing, including the DSP Library (DSPLIB) and the Codec Engine.

In summary, the TMS320C6747DZKB3 is a versatile and powerful DSP that combines high performance with low power consumption, making it an excellent choice for a wide range of signal processing applications. Its robust architecture, extensive connectivity options, and strong development support make it a popular choice among engineers and developers in the field.

Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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