TMS320C6747DZKB4
- Manufacturer's Part No.:TMS320C6747DZKB4
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- Series:TMS320C674x
- Description:IC DSP FIX/FLOAT POINT 256BGA
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- In Stock: 14000
- Available: 2044
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $38.86080 | US $38.86 |
10+ | US $29.14560 | US $291.46 |
30+ | US $25.25952 | US $757.79 |
100+ | US $22.34496 | US $2234.50 |
500+ | US $20.98483 | US $10492.41 |
1000+ | US $19.43040 | US $19430.40 |
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The TMS320C6747DZKB4 is a high-performance digital signal processor (DSP) from Texas Instruments, part of the TMS320C6000 family. This DSP is designed for a wide range of applications, including audio processing, telecommunications, and industrial control systems. Below is a detailed description of its key features and specifications:
Architecture and Performance
- Core Architecture: The TMS320C6747 features a fixed-point and floating-point DSP architecture, which allows it to efficiently handle both types of computations. It is based on the C674x core, which is optimized for high-performance signal processing tasks.
- Clock Speed: The processor operates at a maximum clock frequency of 456 MHz, providing substantial processing power for demanding applications.
- Instruction Set: It supports a rich instruction set that includes both traditional DSP instructions and general-purpose computing instructions, enabling versatile programming capabilities.
Memory and Storage
- Memory Interface: The TMS320C6747 supports various memory types, including external memory interfaces for both SRAM and SDRAM, allowing for flexible memory configurations.
- On-Chip Memory: It includes a certain amount of on-chip RAM, which is used for fast data access and storage of critical algorithms.
- Cache: The DSP features cache memory to enhance performance by reducing the time needed to access frequently used data and instructions.
Connectivity and I/O
- Peripheral Interfaces: The TMS320C6747 is equipped with multiple peripheral interfaces, including:
- Serial Communication Interfaces (SCI): For UART communication.
- SPI and I2C: For interfacing with various sensors and devices.
- McBSP (Multichannel Buffered Serial Port): For audio data transmission.
- GPIO: General-purpose input/output pins are available for interfacing with external devices and controlling various functions.
Power Management
- Power Consumption: The TMS320C6747 is designed with power efficiency in mind, making it suitable for battery-operated devices. It features various power-saving modes to reduce energy consumption during idle periods.
- Operating Voltage: The device typically operates at a voltage range of 1.2V to 1.3V, which is standard for modern DSPs.
Package and Thermal Characteristics
- Package Type: The TMS320C6747DZKB4 is housed in a 100-pin BGA (Ball Grid Array) package, which provides a compact form factor and efficient thermal management.
- Thermal Performance: The device is designed to operate within a specified temperature range, making it suitable for industrial applications where environmental conditions can vary.
Applications
The TMS320C6747 is widely used in various applications, including:
- Audio Processing: For high-fidelity audio applications, including digital audio effects and mixing.
- Telecommunications: In base stations and other communication equipment for signal processing tasks.
- Industrial Control: For real-time processing in automation and control systems.
Development Support
Texas Instruments provides extensive development tools and software support for the TMS320C6747, including:
- Code Composer Studio (CCS): An integrated development environment (IDE) for programming and debugging.
- DSP Libraries: Optimized libraries for signal processing tasks, which help developers accelerate application development.
In summary, the TMS320C6747DZKB4 is a versatile and powerful DSP that combines high performance with efficient power management, making it suitable for a wide range of applications in the fields of audio, telecommunications, and industrial control. Its rich set of features and extensive development support make it an attractive choice for engineers and developers looking to implement advanced signal processing solutions.
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
SHIPPING GUIDE
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Delivery Time
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