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TMS320VC33PGE150

  • In Stock: 2320
  • Available: 1856

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $46.13440US $46.13
10+US $34.60080US $346.01
30+US $29.98736US $899.62
100+US $26.52728US $2652.73
500+US $24.91258US $12456.29
1000+US $23.06720US $23067.20

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Description
TMS320VC33PGE150 Description
The TMS320VC33 DSP is a 32-bit, floating-point processor manufactured in 0.18-μm four-level-metal CMOS (TImeline) technology.
The TMS320VC33 is part of the TMS320C3x generation of DSPs from Texas Instruments.
The TMS320C3x’s internal busing and special digital-signal-processing instruction set have the speed and flexibility to execute up to 150 million floating-point operations per second (MFLOPS).
The TMS320VC33 optimizes speed by implementing functions in hardware that other processors implement through software or microcode. This hardware-intensive approach provides performance previously unavailable on a single chip.
The TMS320VC33 can perform parallel multiply and ALU operations on integer or floating-point data in a single cycle. Each processor also possesses a general-purpose register file, a program cache, dedicated ARAUs, internal dual-access memories, one DMA channel supporting concurrent I/O, and a short machine-cycle time. High performance and ease of use are the results of these features.General-purpose applications are greatly enhanced by the large address space, multiprocessor interface, internally and externally generated wait states, one external interface port, two timers, one serial port, and multiple-interrupt structure.
The TMS320C3x supports a wide variety of system applications from host processor to dedicated coprocessor. High-level-language support is easily implemented through a register-based architecture, large address space, powerful addressing modes, flexible instruction set, and well-supported floating-point arithmetic.
The TMS320VC33 is a superset of the TMS320C31. Designers now have an additional 1M bits of on-chip SRAM, a maximum throughput of 150 MFLOPS, and several I/O enhancements that allow easy upgrades to current systems or creation of new baselines. This data sheet provides information required to fully utilize the new features of the TMS320VC33 device. For general TMS320C3x architecture and programming information, see the TMS320C3x User’s Guide (literature number SPRU031). TMS320VC33PGE150
Features High-Performance Floating-Point Digital Signal Processor (DSP):-- TMS320VC33-150-- 13-ns Instruction Cycle Time-- 150 Million Floating-Point Operations Per Second (MFLOPS)-- 75 Million Instructions Per Second (MIPS)-- TMS320VC33-120-- 17-ns Instruction Cycle Time-- 120 MFLOPS-- 60 MIPS34K × 32-Bit (1.1-Mbit) On-Chip Words of Dual-Access Static Random-Access Memory (SRAM) Configured in 2 × 16K Plus 2 × 1K Blocks to Improve Internal Performancex5 Phase-Locked Loop (PLL) Clock GeneratorVery Low Power: < 200 mW @ 150 MFLOPS32-Bit High-Performance CPU16-/32-Bit Integer and 32-/40-Bit Floating-Point OperationsFour Internally Decoded Page Strobes to Simplify Interface to I/O and Memory DevicesBoot-Program LoaderEDGEMODE Selectable External Interrupts32-Bit Instruction Word, 24-Bit AddressesEight Extended-Precision RegistersOn-Chip Memory-Mapped Peripherals:-- One Serial Port-- Two 32-Bit Timers-- Direct Memory Access (DMA) Coprocessor for Concurrent I/O and CPU OperationFabricated Using the 0.18-μm (leff-Effective Gate Length) TImeline™ Process Technology by Texas Instruments (TI)144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix)Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)Two Low-Power ModesTwo- and Three-Operand InstructionsParallel Arithmetic/Logic Unit (ALU) and Multiplier Execution in a Single CycleBlock-Repeat CapabilityZero-Overhead Loops With Single-Cycle BranchesConditional Calls and ReturnsInterlocked Instructions for Multiprocessing SupportBus-Control Registers Configure Strobe-Control Wait-State Generation1.8-V (Core) and 3.3-V (I/O) Supply VoltagesOn-Chip Scan-Based Emulation Logic, IEEE Std 1149.1† (JTAG)
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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