TMS320VC5510AZGWA2
- Manufacturer's Part No.:TMS320VC5510AZGWA2
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- Series:TMS320C55x
- Description:IC FIXED POINT DSP 240-BGA
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- In Stock: 100000
- Available: 2537
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $84.46000 | US $84.46 |
10+ | US $63.34500 | US $633.45 |
30+ | US $54.89900 | US $1646.97 |
100+ | US $48.56450 | US $4856.45 |
500+ | US $45.60840 | US $22804.20 |
1000+ | US $42.23000 | US $42230.00 |
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- Description
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- Shopping Guide
The TMS320VC5510/5510A (5510/5510A) fixed-point digital signal processors (DSPs) are based on the TMS320C55x DSP generation CPU processor core.
The C55xDSP architecture achieves high performance and low power through increased parallelism and total focus on reduction in power dissipation.
The CPU supports an internal bus structure composed of one program bus, three data read buses, two data write buses, and additional buses dedicated to peripheral and DMA activity.
These buses provide the ability to perform up to three data reads and two data writes in a single cycle. In parallel, the DMA controller can perform up to two data transfers per cycle independent of the CPU activity.
Features · High-Performance, Low-Power, Fixed-Point TMS320C55x Digital Signal Processor (DSP)− 6.25-/5-ns Instruction Cycle Time− 160-/200-MHz Clock Rate− One/Two Instructions Executed per Cycle− Dual Multipliers (Up to 400 Million Multiply-Accumulates Per Second (MMACS))− Two Arithmetic/Logic Units− One Internal Program Bus− Three Internal Data/Operand Read Buses− Two Internal Data/Operand Write Buses· Instruction Cache (24K Bytes)· 160K x 16-Bit On-Chip RAM Composed of:− Eight Blocks of 4K × 16-Bit Dual-Access RAM (DARAM) (64K Bytes)− 32 Blocks of 4K × 16-Bit Single-Access RAM (SARAM) (256K Bytes)· 16K × 16-Bit On-Chip ROM (32K Bytes)· 8M × 16-Bit Maximum Addressable External Memory Space· 32-Bit External Memory Interface (EMIF) With Glueless Interface to:− Asynchronous Static RAM (SRAM)− Asynchronous EPROM− Synchronous DRAM (SDRAM)− Synchronous Burst SRAM (SBSRAM)
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
SHIPPING GUIDE
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