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TXB0304RUTR

  • In Stock: 30000
  • Available: 185043

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.38594US $0.39
10+US $0.25729US $2.57
30+US $0.19297US $5.79
100+US $0.15438US $15.44
500+US $0.14151US $70.76
1000+US $0.12865US $128.65

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  • esd
  • as
  • iso14001
  • iso9001
  • D&B
  • Description
  • Alternatives
  • Shopping Guide
Description
Description This 4-bit non-inverting translator uses two separate configurable power-supply rails.
The A port is designed to track VCCA. VCCA accepts any supply voltage from 0.9 V to 3.6 V.
The B port is designed to track VCCB. VCCB accepts any supply voltage from 0.9 V to 3.6 V. This allows for low Voltage bidirectional translation between 1 V, 1.2 V, 1.5 V, 1.8V, 2.5 V and 3.3 V voltage nodes. For the TXB0304,when the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
The OE device control pin input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff.
The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The only difference between TXB0304 and TXBN0304 is the OE signal being active high and active low respectively.
Features
• Fully Symmetric Supply Voltages, 0.9 V to 3.6 Von A Port and 0.9 V to 3.6 V
• VCC Isolation Feature
– If Either VCC Input is atGND, all Outputs are in High-Impedance State
• OE Input Circuit Referenced to VCCA
• Low Power Consumption, 5 μA Max (ICCA or ICCB)
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA PerJESD 78, Class II
• ESD Protection Exceeds JESD 22– 8000-V Human-Body Model (A114-B)– 1000-V Charged-Device Model (C101) Applications
• Personal Electronics
• Industrial
• Enterprise
• Telecom
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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