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XC7Z030-2FBG676I

  • In Stock: 235
  • Available: 268

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $143.45100US $143.45
10+US $111.57300US $1115.73
30+US $95.63400US $2869.02
100+US $87.66450US $8766.45
500+US $84.47670US $42238.35
1000+US $79.69500US $79695.00

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Description
XC7Z030-2FBG676I
The Xilinx Zynq®-7000 All Programmable SoC (AP SoC) family integrates software programmability of an ARM® based processor with hardware programmability of FPGA enabling key analytics and hardware acceleration while integrating CPU, DSP, ASSP and mixed signal functionality on a single device. Available in single-core Zynq®-7000S and dual-core Zynq®-7000 devices. Zynq®-7000S devices feature single core ARM® Cortex™-A9 processor mated with 28nm Artix®-7 based programmable logic representing lowest cost entry point to the scalable Zynq®-7000 platform. Ideal for industrial IoT applications such as motor control and embedded vision. Zynq®-7000 devices are equipped with dual-core ARM® Cortex™-A9 processors integrated with 28nm Artix®-7 or Kintex®-7 based programmable logic (up to 6.6M logic cells of logic and 12.5Gb/s transceivers) for excellent performance-per-watt, maximum design flexibility and to enable highly differentiated designs for wide range of embedded applications.XC7Z030-2FBG676I
Features8-channel DMA controller, 2 x UART, 2 x CAN 2.0B, 2 x I2C, 2 x SPI, 4 x 32b GPIO peripherals2 x USB 2.0 (OTG), 2 x tri-mode gigabit Ethernet, 2 x SD/SDIO key peripheralsRSA authentication, AES and SHA 256bit decryption and authentication for secure bootZynq®-7000 AP SoC provides smarter, optimized and most secure solutionUnmatched integration, performance and power, proven productivityAvailable in -3, -2, -2L, -1, -1L speed grades and commercial/ industrial/ extended temperature2.5DMIPS/MHz per CPU, 1GHz CPU frequency, ARMv7-A and Jazelle RCT execution environment architectureNEON™ media processing engine, vector floating point unit, CoreSight™ and program trace macrocell32KB instruction, 32KB data per processor L1 cache, 512KB L2 cache, 256KB on-chip memoryDDR3, DDR3L, DDR2, LPDDR2 external memory support and 2 x quad-SPI, NAND, NOR static memory support
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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