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XCF02SVOG20C

  • In Stock: 1000
  • Available: 7460

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $23.21520US $23.22
10+US $17.41140US $174.11
30+US $15.08988US $452.70
100+US $13.34874US $1334.87
500+US $12.53621US $6268.11
1000+US $11.60760US $11607.60

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  • Description
  • Alternatives
  • Shopping Guide
Description
Description
The Platform Flash line of in-system programmable configuration PROMs from Xilinx is now available.
These PROMs, which are available in densities ranging from 1 to 32 Mb, provide an easy-to-use, cost-effective, and reprogrammable solution for storing huge Xilinx FPGA configuration bitstreams.
The 3.3V XCFxxS PROM and the 1.8V XCFxxP PROM are both part of the Platform Flash PROM series.
The XCFxxS version comprises PROMs with capacities of 4 Mb, 2 Mb, and 1 Mb that support Master Serial and Slave Serial FPGA configuration modes.
The 32 Mb, 16 Mb, and 8 Mb PROMs of the XCFxxP version support Master Serial, Slave Serial, Master SelectMAP, and Slave SelectMAP FPGA setup modes. PROMs can output data at rates of up to 33 MHz when powered by a reliable external clock.  
Features
• Operating Characteristics– Voltage range: 1.71 to 3.6 V– Flash write voltage range: 1.71 to 3.6 V– Temperature range (ambient): -40 to 105°C
• Performance– Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz
• Memories and memory interfaces– Up to 512 KB program flash memory on non FlexMemory devices– Up to 128 KB RAM– Serial programming interface (EzPort)– FlexBus external bus interface
• Clocks– 3 to 32 MHz crystal oscillator– 32 kHz crystal oscillator– Multi-purpose clock generator
• System peripherals– 10 low-power modes to provide power optimization based on application requirements– Memory protection unit with multi-master protection– 16-channel DMA controller, supporting up to 64 request sources– External watchdog monitor– Software watchdog– Low-leakage wakeup unit
• Security and integrity modules– Hardware CRC module to support fast cyclic redundancy checks– 128-bit unique identification (ID) number per chip
• Human-machine interface– Low-power hardware touch sensor interface (TSI)– General-purpose input/output
• Analog modules– Two 16-bit SAR ADCs– Programmable gain amplifier (up to x64) integrated into each ADC– 12-bit DAC– Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input– Voltage reference
• Timers– Programmable delay block– Eight-channel motor control/general purpose/PWM timer– Two 2-channel quadrature decoder/general purpose timers– Periodic interrupt timers– 16-bit low-power timer– Carrier modulator transmitter– Real-time clock
• Communication interfaces– USB full-/low-speed On-the-Go controller with on chip transceiver– Two Controller Area Network (CAN) modules– Three SPI modules– Two I2C modules– Five UART modules– Secure Digital host controller (SDHC)– I2S module
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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