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CD4027BMG4

  • Available: 6

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.52080US $0.52
10+US $0.34720US $3.47
30+US $0.26040US $7.81
100+US $0.20832US $20.83
500+US $0.19096US $95.48
1000+US $0.17360US $173.60

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  • Description
  • Alternatives
  • Shopping Guide
Description
DescriptionCD4027BMS is a single monolithic chip integrated circuit containing two identical complementary-symmetry J-K master slave flip-flops. Each flip-flop has provisions for individual J, K, Set Reset, and Clock input signals. Buffered Q and Q signals are provided as outputs. This input-output arrangement provides for compatible operation with the Intersil CD4013B dual D type flip-flop.
The CD4027BMS is useful in performing control, register, and toggle functions. Logic levels present at the J and K inputs along with internal self-steering control the state of each flip-flop; changes in the flip-flop state are synchronous with the positive-going transition of the clock pulse. Set and reset functions are independent of the clock and are initiated when a high level signal is present at either the Set or Reset input.
The CD4027BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T Frit Seal DIP H1E Ceramic Flatpack H6W
Features
• High Voltage Type (20V Rating)
• Set - Reset Capability
• Static Flip-Flop Operation - Retains State Indefinitely with Clock Level Either “High” or “Low”
• Medium Speed Operation - 16MHz (typ.) Clock Toggle Rate at 10V
• Standardized Symmetrical Output Characteristics
• 100% Tested For Quiescent Current at 20V
• Maximum Input Current of 1µA at 18V Over Full Package-Temperature Range; - 100nA at 18V and +25oC
• Noise Margin (Over Full Package Temperature Range): - 1V at VDD = 5V - 2V at VDD = 10V - 2.5V at VDD = 15V
• 5V, 10V and 15V Parametric Ratings
• Meets All Requirements of JEDEC Tentative Standard No. 13B, “Standard Specifications for Description of ‘B’ Series CMOS Devices” Applications
• Registers, Counters, Control Circuits
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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