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CLVC2G126MDCUTEP

  • In Stock: 4775
  • Available: 250

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $34.68000US $34.68
10+US $26.01000US $260.10
30+US $22.54200US $676.26
100+US $19.94100US $1994.10
500+US $18.72720US $9363.60
1000+US $17.34000US $17340.00

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  • Description
  • Alternatives
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Description

The CLVC2G126MDCUTEP is a dual non-inverting buffer/line driver IC designed for general-purpose logic level translation applications. It features two independent channels, each capable of driving a signal from a lower voltage (LV) to a higher voltage (HV), or vice versa, while providing high-speed performance and low power consumption.

Key Features:

  • Dual Independent Channels: The IC consists of two identical buffer/line driver channels, allowing for simultaneous translation of two separate input signals to corresponding output signals.
  • Non-Inverting Logic Translation: It provides non-inverting logic level translation, meaning that the output signal follows the logic state of the input signal without inversion.
  • Wide Voltage Range: The CLVC2G126MDCUTEP supports a wide range of input and output voltage levels, making it suitable for interfacing between different logic families or voltage domains.
  • High-Speed Operation: With fast propagation delays and transition times, the IC enables high-speed signal transmission, making it suitable for use in applications requiring rapid data transfer.
  • Low Power Consumption: It is designed for low power consumption, helping to minimize energy usage and extend battery life in portable electronic devices.
  • Latch-Up Performance: The IC exhibits excellent latch-up performance, ensuring robust operation and reliability in noisy or harsh electrical environments.
  • ESD Protection: It incorporates electrostatic discharge (ESD) protection features to safeguard the device against damage from static electricity during handling and operation.
  • Space-Saving Package: Housed in a compact leadless package (DCU), the CLVC2G126MDCUTEP offers space-saving advantages and facilitates high-density board layouts in space-constrained applications.

Applications:

  • Level shifting and voltage translation in mixed-voltage systems
  • Interface between different logic families (e.g., CMOS, TTL, LVCMOS)
  • Signal buffering and line driving in data communication systems
  • General-purpose digital signal level conversion
  • Portable and battery-powered devices requiring low power consumption
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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