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M27C256B-12F6

  • In Stock: 519
  • Available: 12060

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $19.53600US $19.54
10+US $17.58240US $175.82
30+US $13.67520US $410.26
100+US $11.23320US $1123.32
500+US $10.74480US $5372.40
1000+US $9.76800US $9768.00

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Description

The M27C256B-12F6 is a 32K x 8 UV EPROM (Electrically Programmable Read-Only Memory) manufactured by STMicroelectronics. It belongs to the M27C series of EPROMs, known for their reliability, high performance, and ease of integration into various electronic systems.

Key Features:

  • 32K x 8 Organization: The M27C256B-12F6 features a 32 kilobyte (32K) memory array organized as 32,768 words of 8 bits each, providing ample storage capacity for program and data storage applications.

  • Fast Access Time: With a fast access time of 120 nanoseconds (ns), this EPROM ensures rapid read access to stored data, enabling efficient operation in time-critical applications.

  • Wide Operating Voltage Range: Supporting an operating voltage range from 4.5 volts (V) to 5.5 volts (V), the M27C256B-12F6 offers flexibility in powering the device from various power sources, enhancing its compatibility with different systems.

  • Low Power Consumption: This EPROM operates at low power consumption levels, making it suitable for battery-powered and energy-efficient applications.

  • High Reliability: Built with advanced CMOS technology and featuring a robust design, the M27C256B-12F6 offers high reliability, endurance, and data retention, ensuring long-term operation in demanding environments.

  • UV EPROM Technology: The M27C256B-12F6 utilizes Ultraviolet (UV) EPROM technology, allowing users to program the memory contents electrically and erase them using ultraviolet light exposure, providing flexibility in programming and reprogramming the device.

  • Parallel Interface: Equipped with a parallel interface, this EPROM facilitates straightforward interfacing with microcontrollers, processors, and other digital ICs (Integrated Circuits), simplifying system integration and design.

  • DIP Package: Housed in a Dual Inline Package (DIP) format, the M27C256B-12F6 offers ease of handling, soldering, and mounting on printed circuit boards (PCBs), making it suitable for a wide range of electronic applications.

  • Extended Temperature Range: Designed to operate over an extended temperature range from -40°C to +125°C, this EPROM is suitable for use in harsh environmental conditions and industrial applications requiring temperature resilience.

Applications:

  • Embedded Systems: Used in embedded systems for firmware storage, program execution, and data logging in applications such as microcontrollers, industrial control systems, and consumer electronics.

  • Legacy Systems: Employed in legacy systems and retrocomputing projects for storing BIOS (Basic Input/Output System), firmware, and program code in vintage computers and electronic equipment.

  • Instrumentation: Utilized in test and measurement instruments, data loggers, and scientific equipment for storing calibration data, configuration settings, and measurement results.

  • Automotive Electronics: Finds applications in automotive electronics for storing firmware, configuration data, and calibration parameters in ECUs (Engine Control Units), instrument clusters, and automotive diagnostic tools.

  • Telecommunications: Used in telecommunications equipment such as modems, routers, and telecommunication switches for storing firmware, configuration files, and operating parameters.

  • Consumer Electronics: Integrated into consumer electronics devices including gaming consoles, set-top boxes, and audio/video equipment for firmware storage, system initialization, and device configuration.

  • Industrial Control: Employed in industrial control systems, PLCs (Programmable Logic Controllers), and SCADA (Supervisory Control and Data Acquisition) systems for program storage, data logging, and process control.

Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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