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SN74LVC1T45YZPR

  • In Stock: 163463
  • Available: 35484

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $0.53766US $0.54
10+US $0.35844US $3.58
30+US $0.26883US $8.06
100+US $0.21506US $21.51
500+US $0.19714US $98.57
1000+US $0.17922US $179.22

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  • Description
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Description

The SN74LVC1T45YZPR is a specific bus transceiver integrated circuit (IC) manufactured by Texas Instruments, a renowned semiconductor company known for its diverse range of electronic components and solutions. This part number suggests that it is likely a single-bit, dual-supply voltage level translator, designed to facilitate bidirectional level shifting between different voltage domains in digital communication systems.

Key Features:

  • Voltage Level Translation: The SN74LVC1T45YZPR is designed to translate logic level signals between different voltage domains, allowing seamless communication between devices operating at different voltage levels.
  • Single-Bit Transceiver: Features a single-bit bidirectional data path, enabling bi-directional data transfer between two voltage domains.
  • Dual-Supply Voltage Compatibility: Supports dual-supply voltage operation, allowing interfacing between systems powered by different supply voltages.
  • Wide Voltage Range: Supports a wide range of input and output voltage levels, making it versatile for use in various digital communication applications.
  • High-Speed Operation: Offers high-speed data transmission capabilities, suitable for applications requiring rapid data transfer rates.
  • Low Power Consumption: Optimized for low power consumption, making it suitable for battery-powered and energy-efficient devices.
  • Latch-Up Performance: Provides robust latch-up performance, ensuring reliability under varying operating conditions and transient events.
  • ESD Protection: Incorporates built-in electrostatic discharge (ESD) protection features, enhancing device reliability and ruggedness in harsh environments.
  • Compact Package: Offered in a compact surface-mount package, facilitating space-efficient designs and integration into electronic circuits.
  • RoHS Compliance: Compliant with the Restriction of Hazardous Substances (RoHS) directive, ensuring environmental sustainability by restricting the use of hazardous materials.

Applications:

  • I2C and SPI Interfaces: Used in digital communication interfaces such as I2C (Inter-Integrated Circuit) and SPI (Serial Peripheral Interface) to enable level shifting between devices operating at different voltage levels.
  • UART and Serial Communication: Integrated into UART (Universal Asynchronous Receiver-Transmitter) and other serial communication interfaces to facilitate voltage translation between microcontrollers, sensors, and other peripheral devices.
  • Battery-Powered Devices: Employed in battery-powered devices and portable electronics for level shifting between low-voltage microcontrollers and higher voltage peripherals.
  • Industrial Automation: Used in industrial automation systems, PLCs (Programmable Logic Controllers), and fieldbus communication networks for interfacing between devices operating at different voltage levels.
  • Embedded Systems: Integrated into embedded systems, IoT (Internet of Things) devices, and sensor networks for level translation between digital sensors, microcontrollers, and communication modules.
  • Telecommunications: Used in telecommunications equipment, networking devices, and data communication systems for level shifting between devices operating at different voltage domains.
  • Automotive Electronics: Employed in automotive electronics applications such as vehicle control systems, infotainment systems, and sensor interfaces for voltage translation between automotive components with different voltage requirements.
  • Consumer Electronics: Integrated into consumer electronics products such as smartphones, tablets, and wearable devices for interfacing between components operating at varying voltage levels.
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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